Philips Lumileds Lighting Company LLC

Future Wei Technologies, Inc.

Koninklijke Philips Corporation N.v.

Lumileds Holding B.v.

Li Zhang

Jeffrey Dellert Kmetec

Yonghua Ding

Jason Yang Sun

Frederic Stephane Diana

Johannes Wilhelmus Weekamp

Frank Michael Steranka

Mina Farr

Brendan Jude Moran

Franklin J Wall, Jr

Serge Laurent Rudaz

Franklin Wall, Jr

Iain Black

Frank J Wall, Jr

Jeff Kmetec

Peter Stormberg

Richard S Kern

Frank J Wall

Johannes W Weekamp

A massively parallel processing shared nothing relational database management system includes a plurality of storages assigned to a plurality of compute nodes. The system comprises a non-transitory memory having instructions and one or more processors in communication with the memory. The one or more processors execute the instructions to store a set of data in a first set of storages in the plurality of storages. The first set of data is hashed into a repartitioned set of data. The first set of storages is reassigned to a second set of compute nodes in the plurality of compute nodes. The repartitioned set of data is distributed to the second set of compute nodes and a database operation is performed on the repartitioned set of data by the second set of compute nodes.

Dynamic computation node grouping with cost based optimization for massively parallel processing

The disclosure relates to technology for query compilation in a database management system. A first execution time of code for at least one database query without applying a code generation method is estimated and in response to receiving the at least one database query, and for one or more code generation methods, a compilation cost and a second execution time of the code as modified by the code generation methods is estimated. A cost savings for each of the one or more code generation methods is calculated, where the cost savings is calculated as the first execution time less the second execution time of the code generation method, less the compilation cost of the code generation method. One of the code generation methods or the no code generation method with the highest cost savings is then selected.

Adaptive code generation with a cost model for JIT compiled execution in a database system

A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

Highly reflective coating on LED submount

An illumination device includes a light source, such as one or more light emitting diodes and a wavelength converting element that is mounted on an opaque support structure. The support structure includes an aperture with which the wavelength converting element is aligned so that the converted light is emitted through the aperture. The wavelength converting element may be a rigid structure, such as a luminescent ceramic and the aperture may be a hole through the support structure. The support structure may hold the wavelength converting element so that it is physically separated from the light source, or alternatively, the support structure may place the wavelength converting element in physical contact with the light source.

Illumination device with a wavelength converting element held by a support structure having an aperture

Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

Solderless integrated package connector and heat sink for LED

A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.

Light emitting diode for mounting to a heat sink

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San Jose, CA, United States of America

Li Zhang