Tpk Advanced Solutions Inc.

Li-Wei Mu

Shan-Yu Wu

Chao-Hui Kuo

Xi-Zhao Wang

Yi-Min Jiang

Chia Jui Lin

Chih-Min Chen

Wei-Chuan Chao

Chun-Wei Liu

Hong-Yan Lian

Can-Liang Zhao

The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.

Contact structure and electronic device having the same

The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.

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Guyuan, China

Li-Wei Mu