Powerchip Semiconductor Manufacturing Corporation

Li-Peng Chang

San-Jung Chang

A semiconductor structure including a substrate, a first isolation structure and a capacitor is provided. The substrate includes a capacitor region. The first isolation structure is disposed in the substrate in the capacitor region. The capacitor is located in the capacitor region. The capacitor includes the substrate in the capacitor region, an electrode layer and a first dielectric layer. The electrode layer is disposed in the substrate in the capacitor region. The first dielectric layer is disposed between the electrode layer and the substrate and between the electrode layer and the first isolation structure. The first dielectric layer is in direct contact with the first isolation structure.

Semiconductor structure and manufacturing method thereof

Provided is a dynamic random access memory (DRAM) including a substrate, a plurality of word-line sets, a plurality of bit-line structures, a plurality of capacitors, a plurality of capacitor contacts, and a plurality of air gaps. The substrate has a plurality of active areas. The word-line sets extend along a Y direction and disposed in the substrate. The bit-line structures extend along a X direction, disposed on the substrate, and across the word-line sets. The capacitors are respectively disposed at two terminals of the active areas. The capacitor contacts are respectively disposed between the capacitors and the active regions. The air gaps are disposed in a plurality of spaces enclosed by the bit-line structures and the capacitor contacts. A method of forming a DRAM is also provided.

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Hsinchu, Taiwan

Li-Peng Chang