Elite Electronic Material (Kunshan) Co., Ltd.

Elite Electronic Material (Zhongshan) Co., Ltd.

Li-Ming Chou

Li-Chih Yu

Yu-Te Lin

Tse-An Lee

Rong-Tao Wang

Chang-Yuan Li

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Halogen-free resin composition

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Tao-Yuan Hsien, Taiwan

Li-Ming Chou