Other

Shanghai Langbo Communication Technology Company Limited

Baoshan Iron & Steel Co., Ltd.

Nio Nextev Limited

Nio (anhui) Holding Co., Ltd.

Shanghai Sinyang Semiconductor Materials Co., Ltd.

Li Ma

Yu Wang

Su Wang

Yanyan Li

Zengfang Ge

Xianxian Yu

Ming Luo

Laizhu Jiang

Zhengyi Jiang

Suzhen Luo

Xiawei Cheng

Jianguo Peng

Jingwei Zhao

James Deng

Bob De Jong

The present invention relates to the technical field of batteries of new energy vehicle, and in particular to a heat exchanger for cooling battery. The present invention aims to solve the problem that existing heat exchangers in the prior art have low heat exchange efficiency and lack of expandability. For this purpose, the heat exchanger for cooling battery according to the present invention comprises a first liquid collection unit, a second liquid collection unit and at least one cooling plate unit provided between the first liquid collection unit and the second liquid collection unit, the first liquid collection unit at least comprising a first liquid collection area, the second liquid collection unit at least comprising a second liquid collection area, and the cooling plate unit comprising a plurality of flow guide elements. Through a modular design, the present invention can make combinations and changes according to variation of size of a battery pack, bring about great degree of freedom in size, reduce cost and shorten production cycle. In addition, a coolant flows in all directions under the action of the flow guide elements, which is advantageous for a uniform distribution of speed in the cooling plate unit and a more uniform distribution of temperature over the entire region of the cooling plate unit. Meanwhile, heat conducting elements play the role of enhancing heat exchange, which is advantageous for an improvement of heat exchange efficiency of the cooling plate.

Heat exchanger for cooling battery

A rolling mill () which is suitable for performing hot stalling rolling includes: a housing (); a first roller () mountable to the housing (); a second roller () mountable to the housing (), wherein the position of the second roller () relative to the housing () is adjustable, thereby adjusting the width of a roll gap () between the first roller () and the second roller (), and wherein the roll gap () is configured to deform a workpiece () when the workpiece () is passed therethrough. The rolling mill provides the advantage of optimizing the rolling process.

Rolling mill

A heat exchanger for battery cooling is provided to improve an efficiency of cooling of the current heat exchangers. The heat exchanger for battery cooling comprises an upper housing with a fluid inlet and a fluid outlet, a lower housing capable of hermetically connecting with the upper housing to form a chamber for accommodating fluid. The fluid flows into the chamber through the fluid inlet and then exits through the fluid outlet. The fluid chamber is provided with at least one S-shaped fluid directing element with several through holes. With the S-shape directing elements within the fluid chamber and the through holes formed on the directing elements, fluid can flow in an injecting manner within the chamber to realize effective cooling of the upper housing.

Heat exchanger for battery cooling

The disclosure is related to a method and used in a user equipment that supports Device to Device transmission in Time Division Duplex system and a user equipment thereof. In one embodiment, UE receives downlink signaling to obtain a first configured frame structure, or determining a first configured frame structure by itself in step, and transmits a first D2D signaling to indicate the first configured frame structure in step; wherein the first configured frame structure indicates a uplink or downlink direction for all the subframes within one radio frame. The technical solution of the disclosure solves the problem of interference of the downlink signals for the UEs configured with different frame structures in D2D communication in eIMTA scenario.

Method and device for communication in D2D UE of TDD system

An additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same. The additive C contains by mass percentage: 5%-10%, one of polyethylene glycol or polyvinyl alcohol with the molecular weight of 200-100,000, or the mixture with different molecular weight thereof; 0.001%-0.5% isomer of the surfactant which including the alkylphenol polyoxyethylene ether or fatty alcohol-polyoxyethylene ether; and the solvent is water. The electroplating solution containing the additive C could be used for microvia-filling by TSV copper plating, the electroplating current distribution could be adjusted reasonably to realize the smooth transition between the conformal and bottom-up plating, so as to reduce the possibility of the seam or void in the coating, realize the high-speed electroplating, reduce the thickness of the copper layer, reduce the TSV plating duration and the cost of the chemical mechanical polishing (CMP), and significantly improve the production efficiency.

Additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same

An additive for reducing voids after annealing of copper plating with through silicon via. The additive contains by weight percent: 0.05-1% of one or more of quaternized polyethylene imine and derivatives thereof having different molecular weights, and 1-10% of polyethylene glycol with an average molecular weight of 200-20000. The additive is used in combination with an electroplating solution of a copper methyl sulfonate system. The electroplating solution of a copper methyl sulfonate system contains 1-5 ml/L of the additive by volume ratio. The electroplating solution of a copper methyl sulfonate system contains by mass volume ratio: 50-110 g/L of copper ions, 5-50 g/L of methanesulfonic acid and 20-80 mg/L of chlorine ions. The electroplating solution also contains by volume ratio: 0.5-5 ml/L of accelerator, 5-20 ml/L of inhibitor and 5-10 ml/L of levelling agent. The additive for reducing voids after annealing of copper plating with through silicon via provided in the present invention can solve the problem of micro-voids between grain boundaries after high temperature annealing of copper plating.

Additive for reducing voids after annealing of copper plating with through silicon via

Growing community of inventors

Shanghai, China

Li Ma