Other

Ningbo Sunny Opotech Co., Ltd.

Huawei Technologies Co., Limited

Semiconductor Manufacturing International (shanghai) Corporation

General Electric Company

International Business Machines Corporation

Honeywell International Inc.

Shanghai Normal University

Shanghai Luyao Energy Technology Co., Ltd.

Shenzhen Leaderway Times Technology Co., Ltd

Daikin Industries, Ltd.

Topin (shanghai) International Trader Co., Ltd.

Liu, Li

Li Liu

Zhen Huang

Bojie Zhao

Zhewen Mei

Chenxiang Xu

Jiawei Chen

Qimin Mei

Zhongyu Luan

Xianyong Pu

Gangning Wang

Guangli Yang

Zongchun Yang

Hong Sun

Jie Liu

Bo Han

Wei Yang

Zhihua Wang

Chuang Huang

Xin Wang

Yu Zhang

Christopher Edward Wolfe

Bin Chen

Yang Zhao

Yong Sen Zheng

Farshad Ghasripoor

Robert Arnold Judge

Ying Zhang

Weifeng Huang

Aurelie Boudier

Lionel Wodecki

Xiao Huang

Ying Li

Hui Huang

Hailong Li

Xue Li

William Henry Lueckenbach

Yue Wu

Stephane Graziani

Lanping Liu

Shuo Feng

Qing Chang

Weihua Shang

Fang Cheng

Xiaoren Wang

Xiangrong Chen

Bin Lu

Xiong Zhou

Xinxiang Sun

Tinghua Li

Jianli Liu

ChiChung Tai

Chihchung Tai

Chengchang Zheng

Ling Long

Yin Lu

QiMin Mei

Hongfeng Gan

Zhiming Pi

Lifang Hu

Yao Chen

Lili Lin

Yuanyun Zhao

Zhenfeng Bian

Mengjiao Xu

Yu Wan

Yongzhi Liu

Jieya Wen

Hexing Li

Kai Chen

Huidong Dai

Tong-hu Xia

Jixiang Hou

Liudi Wang

Fengsu Liu

Zhilong Zhang

Lirui Tian

Pian Wang

Bo Tang

Xianjun Chi

Fang Qiu

Xinjiang Sun

Chenhao Liu

Li Feng

Lei Duan

Zhongqi Liang

Leru Zhou

Haomiao Xu

Yin Chen

Yiping Liu

The present disclosure provides a method for preparing a high-purity powder material, an application thereof, and a double-phase powder material. The high-purity powder material is prepared through an 'atomization comminuting process and de-phasing method'. The preparation method comprises the following steps: firstly preparing intermediate alloy powders with first-phase particles wrapped by a second-phase matrix through an atomization comminuting process. Impurity elements are enriched into the second-phase matrix and the first-phase particles are purified during the solidification of the intermediate alloy powders; By removing the second-phase matrix in the intermediate alloy powders, a high-purity target powder material originated from the original first-phase particles can be obtained. The preparation method of the present disclosure has the characteristics of a simple process, easy operation, and low cost, and can be used to prepare nano-level, sub-micron-level, and micro-level multiple high-purity powder materials, which has a good application prospect in catalytic materials, powder metallurgy.

Method for preparing high-purity powder material, application thereof, and double-phase powder material

Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least part of the substrate.

Molded circuit board and camera module, and manufacturing method thereof and electronic device

The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board. The molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip. In this way, the magnitude of stress that the molded body acts on the photosensitive chip is reduced by means of the slot being disposed in the molded body, so as to effectively reduce the amount of deformation of the photosensitive chip due to the stress.

Photosensitive assembly, camera module and manufacturing methods therefor

A calibration system for calibrating a gas detector includes a control unit and a temperature regulation assembly electrically connected with the control, a temperature sensor electrically connected with the control unit, a set of valves comprising a first valve, a second valve, and a third valve, and a feedback conduit. The control unit is configured to determine whether a temperature of the gas detector is within a predefined temperature range and calibrate the gas detector in an instance in which the temperature is within the predefined temperature range.

Method and system for calibrating a gas detector

The present disclosure relates to the field of reactor technologies and in particular to a solid-liquid phase reactor for preparing a powder product, which includes a vessel shell, a material-restricting partition net, a solid reactant charge opening, and a reaction solution make-up opening. The material-restricting partition net is disposed in a cavity of the vessel shell and connected to the vessel shell. The material-restricting partition net is enclosed to form a semi-closed material-restricting zone with an upward-facing opening itself or together with an inner wall of a vessel. A frame of the semi-closed material-restricting zone is rigid. The solid reactant charge opening is in communication with the facing-up opening of the semi-closed material-restricting zone, and the reaction solution make-up opening is in communication with an internal space of the semi-closed material-restricting zone.

Solid-liquid phase reactor for preparing powder product

A video shooting method includes: enabling a camera application on a terminal and in a slow-motion video recording mode of the camera application, when a motion detection function of the camera application is enabled, starting to capture video frames after a video recording instruction input by a user is detected, recording a second video frame set at a first frame rate automatically when a motion of a human body in a captured first video frame set is a preset motion, and generating a target video, wherein the target video includes a slow-motion video clip, and wherein the slow-motion video clip includes video frames in the second video frame set.

Intelligent video recording method and apparatus

Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

Camera module, and photosensitive assembly and manufacturing method therefor

The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

Photosensitive assembly, camera module and manufacturing method thereof

A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Camera module and molded photosensitive assembly and electronic device

The gas detector calibration system comprises a control unit, a temperature regulation assembly, a pump, and a temperature sensor. The temperature regulation assembly has an inlet and an outlet, and the pump has a pump inlet and a pump outlet. The outlet of the temperature regulation assembly is coupled to the pump inlet of the pump. The temperature regulation assembly receives ambient air through the inlet, regulates a temperature of the ambient air, and supplies the ambient air to the pump through the outlet. The pump supplies the ambient air to a gas detector for regulating a temperature of the gas detector. The temperature sensor detects the temperature and sends a signal indicative of the temperature to the control unit. The control unit determines whether the temperature is within a predefined temperature range, when within the predefined temperature range, the gas detector is calibrated using a calibration gas.

In response to receiving a request for an identity key from a first entity, an identity key for the first entity is generated. A first request from the first entity to replicate a set of data is received. The generated identity key for the first entity is added to the metadata of the set of data requested to be replicated. A determination is made whether a replication rule exists for the first entity. In response to determining that a replication rule exists for the first entity, the set of data is replicated according to the replication rule for the first entity.

Dynamic replication based on identity

The present invention relates to a method for dissolving metals by photocatalysis. A metal-containing material to be dissolved is dispersed in a mixed solution of photocatalyst-containing cyanide and organic chloride; then, a photocatalyst is added; next, an oxygen-containing gas or a substance which is capable of generating oxygen is introduced; and irradiation is applied for a period of time to dissolve metals. Compared with the prior method, the present invention is advantageous in moderate reaction condition, energy conservation, environmental protection, low cost, and convenient operation, and is suitable for mass industrial treatment on metal dissolution.

Method for dissolving metals by photocatalysis

The present disclosure provides a preparation method of a metal powder material. An alloy sheet composed of a matrix phase and a dispersive phase with different chemical reactivities is prepared by the rapid solidification technique of alloy melt. Metal powder is prepared by the reaction of the alloy sheet and an acid solution. Please refer to the description for the detailed preparation method. This method is simple in operation, can be used to prepare many kinds of metal powder materials of different shapes and at the nanometer scale, the submicron scale and the micron scale, and has a good application prospect in the fields of catalysis, powder metallurgy and 3D printing.

Preparation method of metal powder material

A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Camera module and manufacturing method thereof

Growing community of inventors

Shanghai, China

Li Liu