Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Li Kang

John Gregory Woods

Bahram Issari

Chih-Min Cheng

Jiangbo Ouyang

Shengqian Kong

Wenhua Zhang

Yayun Liu

Zachary Bryan

Jesse Lawrence Davis

Zachary Jacob Bryan

Disclosed is a two-component curable polymeric system having increased viscosity. One component contains a homogeneous blend of a polyisocyanate and a homopolymer or copolymer of vinyl acetate. This component has a higher viscosity than the polyisocyanate alone, thereby increasing the viscosity of the two-component curable system. The other component of the two-component curable system is a composition containing an isocyanate reactive component. The polyisocyanate and the isocyanate reactive component react together ('cure') to form a polymer. Typically, but not always, the isocyanate reactive component is a polyol or polyamine that is capable of reacting with the polyisocyanate, thereby forming a polyurethane (polyol) or polyurea (polyamine).

Use of polyvinylacetate polymers or copolymers to increase the viscosity of the isocyanate component of a two-component curable polymeric system

Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Reactive resins and formulations for low refractive index and low dielectric constant applications

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Middletown, CT, United States of America

Li Kang