Au Optronics Corporation

Li-Hui Chen

Chi-Chung Lo

Che-Chih Chang

Chin-Kun Hsieh

Han-Ping Kuo

Chia-Jung Wu

Ya-Ting Ho

A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.

Thermal bonding structure and manufacture process of flexible printed circuit board

Organic light emitting diode (OLED) devices with heat dissipation elements for electronic devices. The OLED devices comprise an OLED module and a frame enclosing the OLED module, wherein the frame comprises an exposing portion to outside the electronic device.

Organic light emitting diode devices

A housing for a liquid crystal display module includes an upper housing, a lower housing and at least one shock absorber. The lower housing has one-stage inner sidewalls to define a top room and a bottom room for accommodating a liquid crystal display panel and a backlight module respectively. The at least one shock absorber on a top surface of the one-stage inner sidewalls has an inclined elastic protrusion with a free end for elastically supporting the liquid crystal display panel when the lower housing is assembled with the upper housing.

Growing community of inventors

Hsinchu, Taiwan

Li-Hui Chen