Tron Future Tech Inc.

Li Han Chang

Yu-Jiu Wang

Ta-Shun Chu

Hao-Chung Chou

Kuan-Neng Chen

Han-Wen Hu

Yi-Chieh Tsai

A radio frequency (RF) receiver includes a radiating element, a chip and a phase shifting circuit. The radiating element is arranged to receive an RF input signal to produce a plurality of electrical signals. The chip includes an amplifier circuit. The amplifier circuit is configured to receive a plurality of phase shifted signals from a plurality of input terminals respectively, and amplify the phase shifted signals to generate an RF output signal. The phase shifting circuit is located outside the chip, and coupled to the output terminals and the input terminals. The phase shifting circuit is arranged to phase shift the electrical signals and accordingly generate the phase shifted signals. The phase shifting circuit and the radiating element are formed on a same substrate.

RF receiver and method for receiving RF input signal

An antenna package is provided. The antenna package includes a glass substrate, a plurality of antennas, a multi-layer circuit structure, and a plurality of radio frequency chips. The glass substrate has a first surface and a second surface. The plurality of antennas are arranged on the first surface of the glass substrate. The multi-layer circuit structure has a first surface and a second surface. The plurality of radio frequency chips are arranged on the first surface of the multi-layer circuit structure. The second surface of the glass substrate is adhered to the second surface of the multi-layer circuit structure.

Antenna package and method for manufacturing an antenna package

An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure is disposed over the first surface of the glass substrate. The plurality of semiconductor chips are mounted over the interconnect structure. The antenna array structure is formed on the second surface of the glass substrate. Furthermore, the plurality of semiconductor chips are coupled to the antenna array structure through the interconnect structure and the glass substrate.

Antenna package structure

An antenna device includes: a substrate; a first ground plate arranged in a first layer and disposed on the substrate; a first signal port and a second signal port arranged in a second layer adjacent to the first layer and configured to transmit a first radio-frequency (RF) signal and a second RF signal, respectively; a first feed line and a second feed line arranged in the second layer and connected to the first signal port and the second signal port, respectively; and a radiation element disposed over the substrate. The substrate is arranged to provide a first signal channel and a second signal channel between the radiation element and the first or second feed line for transmitting the first and second RF signals, the first feed line and the second feed line have different line lengths, and the radiation element at least partially overlaps the first and second signal channels.

Phased array antenna with independent signal calibration

A radio frequency (RF) transmitter includes a radiating element, a chip and a phase shifting circuit. The radiating element is arranged to receive a plurality of electrical signals to produce an RF output signal. The chip includes an amplifier circuit. The amplifier circuit is configured to amplify an RF input signal to generate a plurality of amplified signals at a plurality of output terminals, respectively. The phase shifting circuit is located outside the chip, and coupled to the output terminals and the radiating element. The phase shifting circuit is arranged to phase shift the amplified signals, and accordingly generate the electrical signals fed to the radiating element. The phase shifting circuit and the radiating element are formed on a same substrate.

RF transmitter and method for emitting RF output signal

A method of testing an antenna array includes: receiving a probe needle set and a shielding structure, wherein the shielding structure includes an array of conductive pads. The antenna array includes a substrate and an array of antenna devices. Each of the antenna devices includes: a first and a second slits; a first and a second signal ports; a first and a second feed lines. The first and second feed lines have different line lengths; and a radiation element. The method further includes: causing the shielding structure to cover the radiation element of at least one antenna device; and causing the probe needle set to contact the first and second feed lines for testing the at least one antenna device.

Method and system for testing phased array antenna with independent signal calibration

A near-field testing apparatus for testing a device under test having an array of transmitter antennas is provided. The near-field testing apparatus includes a frame structure and a receiver circuit. The frame structure defines an array of grid sections, and is arranged for receiving the array of transmitter antennas at a first side of the array of grid sections. A periphery of each grid section at the first side surrounds a plurality of transmitter antennas in the array of transmitter antennas. The grid section is arranged to guide respective electromagnetic signals emitted by the transmitter antennas from the first side to a second side of the array of grid sections. The receiver circuit, disposed at the second side of the array of grid sections, is arranged to couple the electromagnetic signals out of the grid section.

Growing community of inventors

Hsinchu, Taiwan

Li Han Chang