Taiwan Semiconductor Manufacturing Comp. Ltd.

Li-Fu Ding

Chao-Yang Yeh

Sa-Lly Liu

Ze-Ming Wu

Chih-Chia Chen

Meng-lin Chung

A method comprises analyzing front side conductive patterns and back side conductive patterns on a semiconductor interposer using a machine implemented RC extraction tool, and outputting data representing a plurality of respective RC nodes from the RC extraction tool to a tangible persistent machine readable storage medium. A substrate mesh model of the semiconductor interposer is generated, having a plurality of substrate mesh nodes. Each substrate mesh node is connected to adjacent ones of the plurality of substrate mesh nodes by respective substrate impedance elements. A set of inputs to a timing analysis tool is formed. The plurality of RC nodes are connected to ones of the plurality of substrate mesh nodes of the substrate mesh model. The set of inputs is stored in a tangible machine readable storage medium.

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Hsinchu, Taiwan

Li-Fu Ding