Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronic Materials Korea Ltd.

Dupont Electronic Materials International, LLC

Li Cui

Shintaro Yamada

James F Cameron

Suzanne M Coley

Paul J LaBeaume

Sheng Liu

Iou-Sheng Ke

Keren Zhang

Joshua A Kaitz

Charlotte A Cutler

Mingqi Li

Daniel Greene

Peter Trefonas, Iii

Owendi Ongayi

Sung Wook Cho

Christopher P Sullivan

Robert L Auger

Bhooshan C Popere

Cecilia W Kiarie

Deyan Wang

Emad Aqad

William Williams, Iii

Ke Yang

Christopher D Gilmore

Dan B Millward

Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.

Aromatic underlayer

A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14):D-(L-Ar—[X])  (14); anda solvent, wherein, in formula (14), D is a substituted or unsubstituted Corganic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted Corganic group; each Lis independently a single bond or a divalent linking group, when Lis a single bond, D may be a substituted or unsubstituted Ccycloalkyl or substituted or unsubstituted Cheterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic Caromatic group, each X is independently —OR, —SR, or —NRR, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and Rto Rare as provided herein.

Adhesion promoting photoresist underlayer composition

An underlayer composition, comprising a polymer comprising a repeating unit of formula (1): wherein Ar is a monocyclic or polycyclic Caromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; X is C or O; R, R; Rand Rare as provided herein; optionally, Rand Rcan be taken together form a 5- to 7-membered ring; optionally, one of Rto Rcan be taken together with Rto form a 5- to 7-membered ring; wherein Rand Roptionally may be taken together to form a 5- to 7-membered ring; wherein one of Ror Roptionally may be taken together with Rto form a 5- to 7-membered ring; and when X is O, Rand Rare absent.

Underlayer compositions and patterning methods

Coating compositions comprise: a curable compound comprising: a core chosen from a Ccarbocyclic aromatic ring, a Cheterocyclic aromatic ring, a Cfused carbocyclic aromatic ring system, a Cfused heterocyclic aromatic ring system, Caliphatic, and Ccycloaliphatic, and three or more substituents of formula (1) wherein at least two substituents of formula (1) are attached to the aromatic core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition.

Coating compositions and methods of forming electronic devices

Coating compositions comprise: a B-staged reaction product of one or more compounds comprising: a core chosen from Ccarbocyclic aromatic, Cheterocyclic aromatic, Caliphatic, Cheteroaliphatic, Ccycloaliphatic, and Cheterocycloaliphatic, each of which may be substituted or unsubstituted; and two or more substituents of formula (1) attached to the core: wherein: Aris an aromatic group independently chosen from Ccarbocyclic aromatic and Cheteroaromatic, each of which may be substituted or unsubstituted; Z is a substituent independently chosen from OR, protected hydroxyl, carboxyl, protected carboxyl, SR, protected thiol, &#x2014;O&#x2014;C(&#x2550;O)&#x2014;Calkyl, halogen, and NHR; wherein each Ris independently chosen from H, Calkyl, Cunsaturated hydrocarbyl, and Caryl; each Ris independently chosen from H, Calkyl, Cunsaturated hydrocarbyl, Caryl, C(&#x2550;O)&#x2014;R, and S(&#x2550;O)&#x2014;R; x is an integer from 1 to the total number of available aromatic ring atoms in Ar; and * denotes the point of attachment to the core; provided that when the core comprises an aromatic ring, no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition. Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.

A photoresist underlayer composition, comprising a polymer comprising a repeating unit of formula (1): wherein Ar is a monocyclic or polycyclic Caromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; Ris hydrogen, substituted or unsubstituted Calkyl, substituted or unsubstituted Cheteroalkyl, substituted or unsubstituted Ccycloalkyl, substituted or unsubstituted Cheterocycloalkyl, substituted or unsubstituted Calkenyl, substituted or unsubstituted Calkynyl, substituted or unsubstituted Caryl, substituted or unsubstituted Carylalkyl, substituted or unsubstituted Calkylaryl, substituted or unsubstituted Cheteroaryl, or substituted or unsubstituted Cheteroarylalkyl; and Ris substituted or unsubstituted Calkyl, substituted or unsubstituted Cheteroalkyl, substituted or unsubstituted Ccycloalkyl, substituted or unsubstituted Cheterocycloalkyl, substituted or unsubstituted Calkenyl, substituted or unsubstituted Calkynyl, substituted or unsubstituted Caryl, substituted or unsubstituted Carylalkyl, substituted or unsubstituted Calkylaryl, substituted or unsubstituted Cheteroaryl, or substituted or unsubstituted Cheteroarylalkyl, wherein Rand Rcan be optionally taken together to form a ring.

Coating composition for photoresist underlayer

Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.

Silicon-containing underlayers

Method using silicon-containing underlayers

Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising one or more condensed polymers having an organic polymer chain having pendently-bound moieties having an acidic proton and a pKa in water from &#x2212;5 to 13 and having pendently-bound siloxane moieties are provided.

Polyarylene resins and compositions containing them are useful as underlayers in semiconductor manufacturing processes.

Aromatic resins for underlayers

A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mof 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:&#x3e;1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

Gap-filling method

Compositions for forming thin, silicon-containing antireflective coatings and methods of using these compositions in the manufacture of electronic devices are provided. Silicon-containing antireflective coatings formed from the these compositions can be easily removed during processing without the need for a separate removal step.

Silicon-based hardmask

Aromatic resin polymers and compositions containing them are useful as underlayers in semiconductor manufacturing processes.

Compositions for forming thin, silicon-containing antireflective coatings and methods of using these compositions in the manufacture of electronic devices are provided. Silicon-containing antireflective coatings formed from these compositions can be easily removed during processing without the need for a separate removal step.

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Westborough, MA, United States of America

Li Cui