Advanced Semiconductor Engineering, Inc.

Other

Li Chieh Chen

Chang Chi Lee

Jung Jui Kang

Chiu-Wen Lee

A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

Semiconductor package including processing element and I/O element

Semiconductor package

The present invention provides a device for mounting a pair of casters to a tubular segment of a structure of a stroller. The mounting device consists of a first sleeve, a second sleeve and a cushion. Generally, the first sleeve is securely attached to a tubular segment of a structure of a stroller by means of a rivet or the like. The second sleeve pivotally receives the first sleeve, thereby permitting them to rotate relative to each other. The cushion consists of a cap-like element, a spring and a plug. The cap-like element has two slots longitudinally extending therein. The plug has a hole transversely extending therethrough. The cap-like element is securely connected with the second sleeve. The spring is received in the cap-like element. The plug is also received in the cap-like element. A shaft on which a pair of casters rotate is inserted through the slots in the cap-like element and the hole of the plug, whereby the spring is sandwiched-between the top in the cap-like element and the plug.

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Kaohsiung, Taiwan

Li Chieh Chen