Industrial Technology Research Institute

Li-Chi Pan

Tzong-Che Ho

Lung-Tai Chen

Pin Chang

Yu-Wen Fan

Yu-Wen Hsu

Chin-Hung Wang

Yu-Jen Wang

Chao-Ta Huang

Jing-Yuan Lin

Jien-Ming Chen

Hsin-Li Lee

Chung-De Chen

Chin-Horng Wang

Chien-Nan Yeh

Tsun-Che Huang

Yu-Sheng Hsieh

Sheah Chen

Wei-Jr Lin

Yao-Jung Lee

Yuan-Xiang Zou

Liang-De Wang

Jui-Ching Hsieh

An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.

Organic packaging carrier

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

MEMS acoustic transducer and method for fabricating the same

A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

Structure and fabrication method of a sensing device

A light collection system including a light concentrating device and a reflective curving-surface device is provided. The light concentrating device receives at least a portion of an incident light and forwardly emits the portion of the incident light after concentrating and passing it through a first focal region, so as to obtain a first-stage output light. The reflective curving-surface device has an entrance aperture for receiving the first-stage output light. The reflective curving-surface device includes a reflective inner curving surface, and at least a portion of the reflective inner curving surface has a second focal region. The first focal region and the second focal region are confocal or approximately confocal within a range. As a result, at least a portion of the first-stage output light is confocally converted into a forwardly emitted second-stage output light.

Method and system for light collection and light energy converting apparatus

A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

Sensing device and manufacturing method thereof

A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

Capacitive transducer and fabrication method

A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

Vacuum hermetic organic packaging carrier

A resonator, an elastic wave transmission element and a method for fabricating the transmission element are provided. The elastic wave transmission element has a first side and a second side. The elastic wave transmission element includes a plurality of structures sequentially arranged along a direction from the first side toward the second side. Each of the structures has a different defect which is different to each other. The impedance of the structures decreases gradually along the direction. As such, the elastic wave transmission element has an impedance match function.

Resonator, elastic wave transmission element and fabrication method thereof

A chip package structure including a heat dissipation substrate, a chip and a heterojunction heat conduction buffer layer is provided. The chip is disposed on the heat dissipation substrate. The heterojunction heat conduction buffer layer is disposed between the heat dissipation substrate and the chip. The heterojunction heat conduction buffer layer includes a plurality of pillars perpendicular to the heat dissipation substrate. The aspect ratio of each pillar is between about 3:1 and 50:1.

Chip package structure and method of fabricating the same

A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

Growing community of inventors

Hsinchu County, Taiwan

Li-Chi Pan