Memsic, Inc.

Aceinna Transducer Systems Co., Ltd.

Memsic Semiconductor (tianjin) Co., Ltd.

Memsic Semiconductor (wuxi) Co., Ltd.

Leyue Jiang

Yang Zhao

Yongyao Cai

Alexander Dribinsky

Albert M Leung

Haidong Liu

Yaping Hua

Weize Xu

Shuo Gu

Jiaoming Qiu

Dalai Li

Piu Francis Man

Bin Li

Paul Zavracky

Hanqin Zhou

Bin Liu

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

Single proof mass based three-axis accelerometer

An integrated current sensor is provided in the present invention. The integrated current sensor includes: a conductor comprising at least one current input pin, at least one current output pin, a first leg portion connected to the at least one current input pin, a second leg portion connected to the at least one current output pin, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing and signal processing unit; an isolation unit configured to be sandwiched between the magnetoresistive sensing and signal processing unit and the conductor; a plurality of signal pins configured for being coupled to the magnetoresistive sensing and signal processing unit via wires respectively; and a package body configured for wrapping part of the conductor, part of the signal pins, the isolation unit and the magnetoresistive sensing and signal processing unit. A direction of current on the first leg portion is opposite to a direction of current on the second leg portion. The signal pins, the at least one current input pin and the at least one current output pin are exposed from the package body. In this way, the integrated current sensor may realize good electrical isolation between a current side and a signal side. In addition, the integrated current sensor has high sensitivity and integration degree due to use of a magnetoresistive sensing way.

Integrated current sensor

A linearity compensation circuit is disclosed for improving the linearity of a sensing signal. The linearity compensation circuit may include a compensator that is capable of receiving a sensing signal from a sensor and generating a compensation signal based on the sensing signal. The linearity compensation circuit may also include an output circuit that is capable of combining the compensation signal and the sensing signal to generate a compensated signal that exhibits an improved linearity. Also disclosed is a sensing apparatus which includes a sensor and the linearity compensation circuit. The sensing apparatus may thus be able to generate a sensing signal that is linear over a wider dynamic range.

Linearity compensation circuit and sensing apparatus using the same

The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Method for wafer-level chip scale package testing

A three-axis magnetic sensor or magnetometer is provided. Two magnetic sensor Wheatstone bridges using barber pole AMR structures are fabricated on opposite sides of a bump structure formed on a substrate to provide surfaces that are at a predetermined angle with respect to the flat surface of the substrate. The bridge assembly is oriented along the Y axis and the bridges are interconnected such that Y and Z channel signals can be produced by processing of the bridge signals. The X channel signals are provided by an X axis sensor provided on the level surface of the substrate.

Monolithic three-axis magnetic field sensor

A multi-axis GMR or TGMR based magnetic field sensor system is disclosed. Preferably a three axis sensor system is provided for sensing magnetic flux along three mutually orthogonal axes, which can be used for magnetic compass or other magnetic field sensing applications. The sensing units are operative to sense X and Y axis magnetic flux signals in the device (XY) plane, while Z axis sensitivity is achieved by use of a continuous ring shaped or octagonal magnetic concentrator that is adapted to convert the Z axis magnetic flux signal into magnetic flux signals in the XY plane.

Planar three-axis magnetometer

A Z-axis capacitive accelerometer includes a substrate, a capacitance sensing plate, a proof mass and at least one pair of spring beams. The capacitance sensing plate includes two symmetrical sense areas to create differential capacitive measurement. A decoupling structure separates the proof mass and the capacitance sensing plate and their rotational motions from each other. In the proposed Z axis capacitive accelerometer, the distance of the capacitance sensing plate relative to its rotation axis is considerably increased, thereby effectively enhancing the sensitivity when measuring the Z-axis acceleration.

Z-axis capacitive accelerometer

Single chip 3-axis thermal accelerometer devices include a substrate, at least one cavity etched in the substrate, a fluid disposed in the cavity, a bridge structure suspended over an opening of the cavity, and a plurality of heater elements and temperature sensing elements disposed on the bridge structure. The substrate has a substantially planar surface defined by X and Y coordinate axes, and the bridge structure is suspended over the opening of the cavity in the X-Y plane. In one embodiment, the bridge structure is configured to position at least two of the temperature sensing elements out of the X-Y plane. The heater and temperature sensing elements are disposed on the bridge structure in optimized arrangements for providing reduced temperature coefficients and for producing output voltages having reduced DC offset and drift.

Growing community of inventors

Wuxi, China

Leyue Jiang