Shocking Technologies, Inc.

Littelfuse, Inc.

Lumileds LLC

Other

Keyssa, Inc.

Lumileds Holding B.v.

Graydon, Bhret

Lex Alan Kosowsky

Robert J Fleming

Bhret Robert Graydon

Grigoriy Basin

Shurui Shang

Brendan Jude Moran

Xiaofeng Chen

Junjun Wu

Thangamani Ranganathan

Daniel Vasquez

Mooi Guan Ng

Chee Ming Thoe

Phillip Barton

Pragnya Saraf

Glen Irvin

Choon Earn Chan

Gary Davis McCormack

Oleg Borisovich Shchekin

Christian Kleijnen

Ning Shi

Hisashi Masui

Srikanth Gondi

Ken Shimizu

Eric Sweetman

Georg Henninger

Udo Karbowski

Manuel Grave

Hideo Kageyama

Bojana Zivanovic

Barbara Muelders

S Rao Peddada

Ken Davis

Anton Belyaev

Djabbar Moustafaev

Yi Shyan Goh

Michael Fouksman

A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

Light emitting device with high near-field contrast ratio

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Converter with glass layers

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

Flexible light-emitting diode lighting strip with interposer

Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Phosphor converter structures for thin film packages and method of manufacture

A light-emitting device is disclosed, including: a substrate; a light-emitting diode (LED) formed on a first surface of the substrate, the LED being arranged to emit primary light; a fence disposed on a second surface of the substrate, the fence including a plurality of walls arranged to define a cell; a light-converting structure disposed in the cell, the light-converting structure being arranged to convert at least a portion of the primary light to secondary light having a wavelength that is different from the wavelength of the primary light; and a reflective element formed on one or more outer surfaces of the walls of the fence, such that the reflective element and the light-converting structure are disposed on opposite sides of the walls of the fence.

LED package including converter confinement

A semiconductor light emitting device (B,C;) may have a reflective side coating () disposed on a sidewall () of a semiconductor light emitting device structure. Such a device may be fabricated by dicing a semiconductor structure to separate a semiconductor light emitting device structure and then forming a reflective side coating () on a sidewall () of the separated semiconductor light emitting device structure.

Semiconductor light emitting device with reflective side coating

A light emitting diode module comprising: at least one light emitting diode structure, an integrated reflector arrangement that comprises a reflector surface for reflecting light from a light emitting area of the light emitting diode structure. The integrated reflector arrangement further comprises a back reflection surface for diffusely reflecting light emitted via a side surface of the light emitting diode structure back to the light emitting diode structure. The back reflection surface is directly attached to at least a part of the side surface such that during operation of the light emitting diode module an emission of stray light by means of the side surface is reduced. The invention finally describes a flash module, an automotive front lighting or a projection light emitting diode system comprising at least one light emitting diode module.

LED module with high near field contrast ratio

Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices.

Contactless signal conduit structures

Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Electric discharge protection for surface mounted and embedded components

Various disclosed aspects provide for protecting components (e.g., integrated circuits) from spurious electrical overvoltage events, such as electrostatic discharge. Embedded components with voltage switchable dielectric materials may protect circuits against electrostatic discharge.

Embedded protection against spurious electrical events

A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a shell, the shell of each core shelled particle being (i) multilayered, and/or (ii) heterogeneous.

Voltage switchable dielectric material containing conductive core shelled particles

A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on-conductor core shell particle constituent for the VSD material.

Voltage switchable dielectric material containing conductor-on-conductor core shelled particles

Growing community of inventors

San Jose, CA, United States of America

Lex Alan Kosowsky