Fci USA, Inc.

Lewis Robin Johnson

Madhumitha Rengarajan

Jan De Geest

A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

High frequency BGA connector

An electrical connector configured for differential pairs with low in-pair skew. The connector may comprise lead frame assemblies, such as insert molded lead frame assemblies, with adjacent conductors configured for reduced skew by distributing skew correction throughout the transmission path through the lead frame assembly. Elongated air gaps are formed in a side of the housing, exposing the longer conductor of each pair. The elongated air gap may span the entire length of the arc of a longer conductor of each pair. The width of this air gap may be different for different pairs in the lead frame assembly and may be selected to cancel or prevent in-pair skew from arising. The width for each pair may be selected to tune the effective dielectric constant of the longer conductor such that its electrical length matches that of the shorter conductor.

Differential pair signal contacts with skew correction

A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.

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York, PA, United States of America

Lewis Robin Johnson