Agilent Technologies, Inc.

Hewlett-packard Company

Keysight Technologies, Inc.

Lewis R Dove

John F Casey

Marvin Glenn Wong

Julius K Botka

Rosemary O Johnson

Ling Liu

James R Drehle

R Frederick Rau, Jr

Anthony R Blume

Daniel J Miller

John Ralph Lindsey

Philip J Yearsley

Ronald W Schroeder

Gregory Steven Lee

Kim Hong Chen

Ron Jay Barnett

David J Dascher

Paul Thomas Carson

Mitsuchika Saito

Michael T Powers

Michael B Whitener

Peter Joseph Martinez

James P Stephens

Dan Garcia

Robert E Alman

Wesley C Whiteley

Doug Baney

Vaddoarahalli K Nagesh

A signal transmission line, includes: a coaxial electrical connector comprising a coaxial electrical connector inner conductor and a coaxial outer conductor; a coaxial cable comprising a coaxial inner conductor and a coaxial outer conductor; and a section of resistive cable disposed between the coaxial cable and the coaxial connector, the section of resistive cable comprising an electrically thin resistive layer disposed between the coaxial cable inner conductor and a section outer conductor. The coaxial cable inner conductor is fastened to the coaxial electrical connector inner conductor.

Hybrid coaxial cable fabrication

A coaxial transmission line, e.g. a coaxial cable, includes an inner electrical conductor, an outer electrical conductor, a dielectric region between the inner electrical conductor and the outer electrical conductor, and an electrically thin resistive layer within the dielectric region and concentric with the inner electrical conductor and the outer electrical conductor. The electrically thin resistive layer is a resistive layer configured to be transparent to a subtantially transverse-electromagnetic (TEM) mode of transmission, while absorbing higher order modes of transmission.

Coaxial transmission line including electrically thin resistive layer and associated methods

Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then 'subsintering' the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.

Methods for making microwave circuits

In a method for making a microwave circuit, a first dielectric is deposited over a ground plane, and then a conductor is formed on the first dielectric. A second dielectric is then deposited over the conductor and first dielectric, thereby encapsulating the conductor between the first and second dielectrics. In one embodiment, a ground shield layer is formed over the first and second dielectrics by 1) precoating the first and second dielectrics with a metallo-organic layer, and then 2) depositing a thickfilm ground shield layer over the precoat layer. Alternately, a ground shield layer is formed over the first and second dielectrics by 1) placing a polymer screen over the first and second dielectrics, and applying pressure to the polymer screen until it at least partially conforms to a contour of the dielectrics, and then 2) printing a thickfilm ground shield layer through the polymer screen.

Methods for making microwave circuits including a ground plane

Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a 'subsintering' of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.

Methods for forming a conductor on a dielectric

A switch includes a switching element, a substrate, and a lid. The substrate has internal and external metal layers separated by at least an insulating layer. The substrate's external metal layer has a first plurality of signal conductors formed therein, at least some of which are in contact with the switching element. The substrate's internal metal layer has a second plurality of signal conductors formed therein, which are electrically coupled to the first plurality of signal conductors by means of a first plurality of conductive vias in the insulating layer. The lid is attached to the substrate to encapsulate the first plurality of signal conductors between the lid and the substrate.

Switch with lid

In one embodiment, a plurality of thickfilm dielectric layers are printed on a substrate, with each successive layer being printed over a previous layer, and with each layer having sloped walls. After printing a first subset of the plurality of thickfilm dielectric layers, a first conductive thickfilm is printed over at least the walls of the first subset of dielectric layers. Then, after printing a second subset of the plurality of thickfilm dielectric layers, a second conductive thickfilm is printed over the second subset of dielectric layers (with the first and second conductive thickfilms being electrically coupled).

Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics

A switch includes a switching element, a substrate, a lid and a thickfilm dielectric. The substrate has a plurality of signal conductors formed thereon, at least some of which are in contact with the switching element. The lid covers the switching element and has a perimeter that intersects at least some of the signal conductors. The thickfilm dielectric is printed on the substrate below the perimeter of the lid, and the lid is mounted on the thickfilm dielectric.

Switch, with lid mounted on a thickfilm dielectric

Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.

An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Apparatus and method to introduce signals into a shielded RF circuit

A switch has a channel plate that defines at least a portion of a number of cavities. A switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid. A plurality of planar signal conductors extend from edges of the switch to within the one or more cavities holding the switching fluid, and are in wetted contact with the switching fluid. Corners in paths of the planar signal conductors may be limited to greater than 90&#xb0;, about 135&#xb0;, or equal to or greater than 135&#xb0;. In one embodiment, signal path corners are so limited, but the planar signal conductors do not extend to the edges of the switch. In another embodiment, the one or more cavities holding the switching fluid are at least partly defined by a bent switching fluid channel.

Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch

A substrate, a method for producing a substrate, and a switch incorporating a substrate are disclosed. In one embodiment, the substrate has a first layer, a first electrode deposited on the first layer, and a second layer mated to the first layer. The second layer defines a duct leading from the first electrode to a surface of the second layer opposite the first electrode. A liquid electrode fills at least a portion of the duct.

Substrate with liquid electrode

A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.

Bent switching fluid cavity

One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint. In case (b) the cover block may be soldered to dielectric layer. In another embodiment for cases (a) and (b) glass frit is used in place of solder. Disturbances to signal line impedance may be compensated by changes in signal conductor width. The layer of suitable dielectric material may be a thin sheet or gasket of previously patterned ceramic material, or it may be formed by the application of a thick film paste. Suitable thick film dielectric materials deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141 A/D thick film compositions from DuPont.

Hermetic seal and controlled impedance RF connections for a liquid metal micro switch

In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that the area between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

Growing community of inventors

Monument, CO, United States of America

Lewis R Dove