International Business Machines Corporation

Lewis D Lipschutz

Ernest N Levine

Horatio Quinones

Joseph L Horvath

Demetrios Balderes

Ralph E Meagher

Frank P Presti

A method of reflowing solder terminals that join an electronic device to a substrate. The method includes the steps of contacting the bottom surface of the substrate with a liquid and then controlling the temperature of the liquid when in contact with the substrate so that the temperature of the liquid in contact with the substrate is varied. The latter step involves rapidly increasing the temperature of the liquid from a temperature below the melting point of the solder to a temperature exceeding the melting point of the solder and then rapidly decreasing the temperature of the liquid to a temperature below the melting point of the solder.

Bonding method

An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals, (3) a means to contact a surface of the substrate with the liquid, including a reservoir for maintaining the liquid, and a pumping means to move the liquid from the reservoir into contact with the surface of the substrate, and (4) a means to control the temperature of the liquid when in contact with the substrate to initially increase the temperature of the liquid, and subsequently reduce the temperature of the liquid.

Bonding method and apparatus

In accordance with the present invention, we provide a new method for relieving stresses in the device-substrate interconnection structure which greatly enhances the resistance of the interconnection solder bonds to fatigue failure. In accordance with the aforementioned object of the process of our invention for forming improved solder interconnections between integrated circuit semiconductor devices and the supporting substrate, the process includes the step of joining the device I/O pads to the corresponding I/O pads of the substrate by positioning the device over the substrate with solder material selectively positioned between the respective I/O pads, heating the assembly to at least the melting point of the solder material, and cooling to solidify the solder. Subsequently, the resultant device-substrate is annealed by heating to an annealing temperature in the range of 115.degree. to 135.degree. C. and maintaining this temperature for a time in excess of 2 days.

Process for forming improved solder connections for semiconductor

A hermetic compression sealing system with a semi-conductor, multi-chip thermal conduction module, involving a ceramic substance which includes interconnected semi-conductor chips containing integrated circuits defining the module; an arrangement is provided for directly sealing the module involving a compression seal which is in direct bearing contact with the substrate, a cover in direct bearing contact with the compression seal, and a clamping plate for holding the cover, compression seal and ceramic substrate in sealing arrangement, thereby forming a sealed chamber surrounding the module; a gas charge, such as of helium or the like, within the chamber enables conducting heat from the semi-conductor chips of the ambient.

Directly sealed multi-chip module

A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate, or cover, featuring a plurality of thin flexible interleaved leaf elements capable of bridging the gap between the device and cold plate, or cover, and accommodating for gap variability and non-parallel surfaces.

Flexible thermal conduction element for cooling semiconductor devices

A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

Telescoping thermal conduction element for semiconductor devices

An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being:

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Poughkeepsie, NY, United States of America

Lewis D Lipschutz