Other

Macdermid, Incorporated

Macdermid Acumen, Inc.

Lev Taytsas

Ernest Long

Andrew M Krol

David W Minsek

Peter E Kukanskis

Ronald Redline

Lucia Justice

Ernest Yakobson

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, R, and Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by a polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.

Method of producing polymeric phenazonium compounds

A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.

Light induced plating of metals on silicon photovoltaic cells

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts as NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, and wherein R&#x2014;N&#x2014;Rrepresents a substituted amine, and Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Rwith its substituent group is a substituted amine, with Rand Rrepresenting any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprises an organic heterocyclic mercapto compound and most preferably an alkali metal hydroxide.

Method for enhancing the solderability of a surface

A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

Method for the manufacture of printed circuit boards

The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic electrocleaning is proposed between activation of the surface and electroplating of the surface.

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Naugatuck, CT, United States of America

Lev Taytsas