Nexperia B.v.

Leung Chi Ho

Pompeo V Umali

Shun Tik Yeung

A semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device may comprise a semiconductor die having a top major surface that has one or more electrical contacts formed thereon, an opposing bottom major surface, and side surfaces; a molding material encapsulating the top major surface, the bottom major surface and the side surfaces of the semiconductor die, wherein the molding material defines a package body that has a top surface and a side surface; wherein the plurality of electrical contacts are exposed on the top surface of the package body and a metal layer is arranged over and electrically connected to the electrical contacts and wherein the metal layer extends to and at least partially covers a side surface of the package body.

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Hong Kong, China

Leung Chi Ho