Taiwan Semiconductor Manufacturing Comp. Ltd.

Leu-Jen Chen

Shang-Yun Hou

Sung-Hui Huang

Tsung-Yu Chen

Kuan-Yu Huang

Chien-Yuan Huang

Shu-Chia Hsu

Yu-Wei Chen

Jui-Hsieh Lai

Yi-Wei Liu

A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Chip package structure

Growing community of inventors

Taipei, Taiwan

Leu-Jen Chen