International Business Machines Corporation

The Carborundum Company

Crystalline Materials Corporation

Other

Lester W Herron

Subhash Laxman Shinde

David B Goland

Benjamin V Fasano

Govindarajan Natarajan

Jon Alfred Casey

Robert W Nufer

Robert Hannon

Gregory M Johnson

Andrew Michael Reitter

Carla Natalia Cordero

John Ulrich Knickerbocker

Rao Venkateswara Vallabhaneni

Jonathan H Harris

Robert A Youngman

Shaji Farooq

David Clifford Long

Donald Rene Wall

Srinivasa S Reddy

Ananda H Kumar

Raj N Master

Vivek M Sura

Sarah Huffsmith Knickerbocker

Niranjan Mohanlal Patel

John Acocella

Richard A Bates

Lisa M Studzinski

James Robert Wylder

Raschid Jose Bezama

Mark J LaPlante

Mario John Interrante

Lawrence D David

Mark William Kapfhammer

Dinesh Gupta

Renuka S Divakaruni

Srinivasa N Reddy

Nabil A Rizk

William Dale Carbaugh, Jr

Anthony Mastreani

Farid Youssif Aoude

Hal Mitchell Lasky

Laertis Economikos

David L Edwards

Sushumna Iruvanti

Charles Hampton Perry

James N Humenik

Thomas Edward Lombardi

Raed A Sherif

Daniel George Berger

Giulio DiGiacomo

Brenda Lee Peterson

Mario E Ecker

Jawahar P Nayak

Robert O Lussow

David J Womac

David H Gabriels

Stephen S Drofitz, Jr

Louis H Wirtz

Yee-Ming Ting

Bernard Schwartz

Mark R Kordus

Larry D Gross

Giai V Yen

Mark S Schneider

Irene S Frantz

John Thomson

Sharon L Tracy

Robert M Troncillito

Bruno Michel

Krishna Gandhi Sachdev

Sudipta Kumar Ray

Mitchell S Cohen

Robert Anthony Rita

Robert William Pasco

Srinivasa S N Reddy

Philip L Flaitz

Keith C O'Neil

Rao R Tummala

Robert J Sullivan

Joseph M Harvilchuck

Richard A Shelleman

Takeshi Takamori

Derry J Dubetsky

Steven P Young

Katharine G Frase

Sara H Knickerbocker

Arlyne M Flanagan

Katherine G Frase

Irvin Huseby

A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Method of preventing solder wetting in an optical device using diffusion of Cr

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/&deg;C. at 100&deg; C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Polymer and ceramic composite electronic substrates

A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.

Process for screening features on an electronic substrate with a low viscosity paste

A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

Multi-chip module and heat-sink cap combination

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.

Pre-patterned substrate layers for being personalized as needed

Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Method for the controlling of certain second phases in aluminum nitride

Disclosed is a flex die punching apparatus for forming an aperture in at least one sheet of material. There is a flexible, extrudable platen which, upon exertion of a force against it, extrudes at least a portion of at least one sheet of material through an aperture of a die. The flexible, extrudable platen may have a punch feature, corresponding to the shape and position of the die aperture, which assists in the extruding of the flexible, extrudable platen through the die aperture and also in the formation of the aperture in the sheet of material. In another embodiment of the invention, there may be a second die wherein the at least one sheet of material is placed between the first and second dies to form the aperture in the sheet of material.

Flex die punching apparatus and method

Method for controlling of certain second phases in aluminum nitride

Copper-based paste containing copper aluminate for microstructural and

The present invention relates generally to a new process for hermetically sealing of a high thermally conductive substrate, such as, an aluminum nitride substrate, using a low thermally conductive interposer and structure thereof. More particularly, the invention encompasses a hermetic cap which is secured to an aluminum nitride substrate using the novel thermal interposer. The novel thermal interposer basically comprises of layers of relatively high thermal conductive metallic materials sandwiching a core layer of low thermal conductive metallic material.

Hermetic sealing of a substrate of high thermal conductivity using an

Multi-chip heat-sink cap assembly

Growing community of inventors

Hopewell Junction, NY, United States of America

Lester W Herron