Motorola Corporation

Les Ticey

James H Knapp

Keith E Nelson

Kevin J Foley

A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and openings are formed in the masking layer (18) to expose the conductive traces (14) and a semiconductor chip attach pad (17). The vent (20) is formed in the masking layer (18). A semiconductor chip (31) is mounted to the semiconductor chip attach pad (17). During a step of encapsulating the semiconductor chip (31) with a mold compound, the vent (20) provides pressure relief.

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Gilbert, AZ, United States of America

Les Ticey