Lucent Technologies Inc.

Leroy D L'Esperance

Richard S Armington

A method for superimposing an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Method for precise alignment and placement of optoelectric components

An apparatus and method is provided that superimposes an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Apparatus for precise alignment and placement of optoelectric components

An apparatus and method are provided to energize an optoelectric component, such as a semiconductor laser chip, exciting a lasing gap to emit light from the front facet of the chip. The laser is positioned on a transparent tool element having a conductive portion thereon. The conductive portion is preferably a metallized ITO surface transparent to visible light. This allows the laser to be energized while simultaneously looking through the tool element to image a feature on the laser. The lasing gap is then located with a high degree of precision with respect to this feature. This precise location information is used to position and bond the laser chip with respect to an optical transmission line with precise alignment.

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Erial, NJ, United States of America

Leroy D L'Esperance