Seagate Technology Incorporated

Leping Li

Pramit P Parikh

Saravuth Keo

Kara L Maytag

Joel William Hoehn

Roger L Hipwell

Jeff O'Konski

Jeffrey Robert O'Konski

Mark Allen Herendeen

Sarah R Marotz

John L Ibele

Edward Alan Knutson

Chin Chong Yew

Joe J Schobel

Yuik Zhi Lim

Ralph Marquart

Andrew S Menz

Choon Yen Lim

Kim Sek Tan

John F Schmidt

Choong Kit Mah

Stephen J Mackin

Soo Chun Loh

A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.

Work piece contact pad with centering feature

Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.

Lapping carrier

The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.

Lapping head with a sensor device on the rotating lapping head

A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.

Row bar thickness measurement device, system and methods

The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Ambient temperature ball bond

Growing community of inventors

Bloomington, MN, United States of America

Leping Li