Applied Materials, Inc.

Other

Proxytrader, Inc.

Leonid Mark Tertitski

Abhilash J Mayur

Alexander Goldin

Dean C Jennings

Mark Yam

Paul A O'Brien

Vernon Behrens

Wolfgang R Aderhold

Norman L Tam

Kim Ramkumar Vellore

Michael Liu

Stephen Moffatt

Lara Hawrylchak

Ilya Perlov

Samuel C Howells

Balasubramanian Ramachandran

Eugene Gantvarg

Dongming Iu

Aaron Jacob Miller

Dinesh Kanawade

Ji-Dih Hu

Colin Fox

Patrick F Stone

Aaron Muir Hunter

Schubert S Chu

Zhepeng Cong

Oleg V Serebryanov

Matthew D Scotney-Castle

Shay Assaf

Alexey Goder

Krishna Kumar Kuttannair

Andrei Ivanov

A method and apparatus for measuring a temperature of a substrate located in a semiconductor processing environment is disclosed. The substrate has a top surface and an edge surface, and is positioned in a prescribed location within the semiconductor processing environment. An infrared camera oriented to view one side of the edge surface of the substrate is triggered to obtain an infrared image of the one side of the edge surface of the substrate. The infrared image is processed to obtain a temperature profile of the substrate.

Method for non-contact low substrate temperature measurement

Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one or more embodiments, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.

Thermal processing chamber with low temperature control

Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one example, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.

Thermal cooling member with low temperature control

Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.

Visual feedback for process control in RTP chambers

A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region.

System and method to detect substrate and/or substrate support misalignment using imaging

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Scanned laser light source

A method and apparatus for targeting a beam of radiation is provided. A beam steering mirror and a beam capture mirror are movably disposed along an optical pathway. A controller moves the beam steering mirror and the beam capture mirror in an x-y plane, and rotates the mirrors, to target the beam to a target location on a surface, while keeping the optical path length substantially constant for all target locations on the surface. The surface is rotated by a rotational actuator to bring all target locations to positions accessible by the beam targeting optics. Imprecision in targeting and optical path length may be compensated by providing an actuated aperture at the beam entry point and/or a variable focus lens with an optical range finding detector, all in communication with the controller.

Laser beam positioning system

Embodiments provide systems, devices, and methods for controlling a laser. The system includes a controller to control a laser, a ramp generator to ramp down laser power, the ramp generator electrically coupled with the controller and coupleable with the laser, and a hardware protection system electrically coupled with the ramp generator, wherein the ramp generator monitors signals sent from the controller and the hardware protection system to the ramp generator to detect signal failure and ramps down the laser power upon signal failure detection. The method includes sending a control status signal from a controller for a laser to a ramp generator, monitoring the control status signal for missing pulses, sending a hardware interlock status signal from a hardware protection system to the ramp generator, monitoring the hardware interlock status signal for signal failure, and ramping down laser power upon detection of missing pulses or signal failure.

Protection device for solid state laser

Thermal flux processing by scanning a focused line beam

An embodiment provides a method to change a graphical user interface in a way that supports runtime modification of an application's GUI without access to the application source code and/or needs no recompilation/restart of the application executable. This method allows the end-user to make runtime modifications of a widget's attributes and/or runtime conversion of widgets into different types of widgets.

Graphical user interface that is convertible at runtime

During fabrication, a rotating semiconductor substrate is radiated in accordance with a thermal recipe. Temperature measurements of the semiconductor substrate are obtained along with the position of the semiconductor substrate at the time of each temperature measurement. It is then determined for the position of the semiconductor substrate whether at least one particular temperature measurement of the temperature measurements should be filtered. If so, at least one filtered temperature measurement is obtained. The radiation of the semiconductor substrate is subsequently controlled based on the temperature measurements, the at least one filtered temperature measurement, and the thermal recipe.

Semiconductor thermal process control

Growing community of inventors

San Jose, CA, United States of America

Leonid Mark Tertitski