Vishay Intertechnology, Inc.

Leonid Akhtman

Michael Belman

Sakaev Matvey

A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

Sulfuration resistant chip resistor and method for making same

A chip resistor includes an insulating substrate, top terminal electrodesformed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive elementthat is situated between the top terminal electrodesand overlaps them partially, an optional internal protective coatingthat covers resistive elementcompletely or partially, an external protective coatingthat covers completely the internal protection coatingand partially covers top terminal electrodes, a plated layer of nickelthat covers face sides of the substrate, topand bottomelectrodes, and overlaps partially external protective coating, finishing plated layerthat covers nickel layer. The overlap of nickel layerand external protective layerpossesses a sealing property because of metallization of the edges of external protective layerprior to the nickel plating process.

The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.

Growing community of inventors

Shani, Israel

Leonid Akhtman