Sun Microsystems, Inc.

Oracle America, Inc.

Leoncio D Lopez

David K McElfresh

Dan Vacar

Kenny C Gross

Robert H Melanson

Aleksey M Urmanov

Anton A Bougaev

Kalyanaraman Vaidyanathan

Some embodiments of the present invention provide a system for in-situ characterization of a solid-state light. First, a voltage and a current of the solid-state light source are monitored. Then, the health of the solid-state light source is characterized based on an analysis of the monitored voltage and current.

In-situ characterization of a solid-state light source

A method for generating a service action for a computer system is described. During the method, a longevity index value for a packaging technology in the computer system is calculated using a longevity model and thermal and vibration telemetry data that is collected in the computer system. This longevity model may be based on accelerated failure testing of the packaging technology, field failures of the packaging technology in a group of computer systems that includes the computer system, and/or thermal and vibration telemetry data for the group of computer systems. Furthermore, using the longevity index value, the service action for the computer system is determined. Based on the longevity index value, remedial as action, e.g., repairs to the computer system, may be scheduled and performed.

Estimating ball-grid-array longevity in a computer system

One embodiment of the present invention provides a system that estimates the relative humidity inside a computer system. During operation, a set of performance parameters of the computer system and an external relative humidity outside of the computer system are monitored. Then, the relative humidity inside the computer system is estimated based on the set of performance parameters, the external relative humidity, and a relative humidity model, wherein training of the relative humidity model includes measuring an external training relative humidity outside of the computer system and a training relative humidity inside the computer system while monitoring the set of performance parameters of the computer system.

Estimating relative humidity inside a computer system

One embodiment provides a system that analyzes an electrical connection in a computer system. During operation, the system monitors a reflection coefficient associated with the electrical connection and applies a sequential-analysis technique to the reflection coefficient to determine a statistical deviation of the reflection coefficient. Next, the system assesses the integrity of the electrical connection based on the statistical deviation of the reflection coefficient. Finally, the system uses the assessed integrity to maintain the electrical connection.

Enhanced characterization of electrical connection degradation

A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.

Apparatus and method for testing electrical interconnects with switches

A system that detects multiple anomalies in a cluster of components is presented. During operation, the system monitors derivatives obtained from one or more inferential variables which are received from sensors in the cluster of components. The system then determines whether one or more components within the cluster have experienced an anomalous event based on the monitored derivatives. If so, the system performs one or more remedial actions.

Method and apparatus for detecting multiple anomalies in a cluster of components

A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.

Apparatus and method for testing electrical interconnects

One embodiment of the present invention provides a system that performs a real-time root-cause-analysis for a degradation event associated with a component under test. During operation, the system monitors a telemetry signal collected from the component, and while doing so, attempts to detect an anomaly in the telemetry signal. If an anomaly is detected in the telemetry signal, the system performs a failure analysis on the telemetry signal in real-time while the telemetry signal is degrading. Next, the system identifies a failure mechanism for the component based on the failure analysis.

Method and apparatus for performing a real-time root-cause analysis by analyzing degrading telemetry signals

A method for testing a substrate by using a photoemission microscope is provided which includes providing the substrate and applying a reverse bias voltage to the substrate. The method further includes detecting light emissions from a top surface of the substrate and characterizing viability of the substrate from the detection of the light emissions.

Technique for diagnosing and screening optical interconnect light sources

A system that detects the onset of degradation for interconnections in a component within a computer system. During operation, the system monitors inferential variables associated with the interconnections during operation of the computer system. Next, the system determines a present state of the component from the monitored inferential variables. The system then compares the present state of the component with an initial state of the component. If the comparison indicates that the interconnections in the component have reached or will reach a limited operating state (LOS), the system performs a remedial action.

Method and apparatus for proactive fault monitoring in interconnects

One embodiment of the present invention provides a system that tests the quality and/or the reliability of a component. During operation, the system applies test conditions to a plurality of specimens of the component. While applying the test conditions, the system measures the same variable from each of the plurality of specimens. Next, the system computes a running average of the measured variable across the plurality of specimens. The system then computes residuals between the measured variable for each specimen and the running average. The system next determines from the residuals whether the associated specimens are degraded.

Determining the quality and reliability of a component by monitoring dynamic variables

A system that characterizes degradation of a component in a system. During operation, the system monitors inferential variables associated with a specimen of the component. Next, the system determines a time for the onset of degradation for the specimen and determines a time for the completion of degradation for the specimen. The system then computes a time interval between the onset of degradation and the completion of degradation, and uses the time interval to look up an entry in a defect library to obtain information which characterizes the degradation of the specimen of the component.

Characterizing degradation of components during reliability-evaluation studies

A method for assessing a reliability of a complex component having a plurality of similar subcomponents is described. The complex component is divided into a plurality of component parts, each component part including at least one of the subcomponents. Specification ranges are identified for measured variables within which the component parts are considered to be operating within specification. The complex component is subjected to a reliability test and reliability data is obtained for the component parts by comparing the measured variable for each of the component parts with the specification ranges to determine failure times. A system and machine readable medium embodying program instructions is also provided.

Reliability prediction for complex components

One embodiment of the present invention provides a system that determines the reliability of a component in a system. During operation, the system monitors inferential variables associated with a number of specimens of the component. The system then collects degradation data by first computing a likelihood value that indicates whether an inferential variable associated with a specimen of the component is behaving normally or abnormally. Next, the system determines whether the specimen of the component has degraded based on the likelihood value. If the specimen of the component is determined to have degraded, the system records the time when the specimen of the component was determined to have degraded. The system also uses the degradation data to determine the reliability of the component in the system.

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Escondido, CA, United States of America

Leoncio D Lopez