Honeywell International Inc.

Leonard Hilton

Wei Yang

Yuandong Gu

Jong Moon Park

Ulrich Bonne

Tom M Rezachek

Dan W Youngner

Gregg M Swenson

A process to fabricate a fin for a heat sink includes creating an array of micro diameter holes on a substrate, and then coupling the substrate to a mold. The mold includes angular dimples such that one or more of the micro diameter holes on the substrate come into contact with the angular dimples in the mold, thereby forming an angle between the micro diameter holes and a surface of the substrate. The process further includes placing the substrate onto a plate. The plate includes micro air channels such that the micro air channels are in communication with the micro diameter holes. In another embodiment, two pieces of substrate, each with micro diameter holes and embossed micro air channels are coupled together to form a fin.

Fin fabrication process for entrainment heat sink

Entrainment heat sink devices and methods of forming entrainment heat sink devices are described herein. One or more method embodiments include forming an opening through a first material, forming a dimple having a trapezoidal-cross section in the first material such that the opening is located on a side wall of the trapezoidal cross-section, and attaching the first material to a second material, wherein the first material or the second material has a trench formed therein and the first material is attached to the second material such that the trench is in fluidic communication with the dimple.

Entrainment heat sink devices

A highly sensitive fluid composition analyzer where a fluid may be placed in contact with a very small area on a material sensitized to change color in the presence of a specific type of compound, to be impinged with light. The light reflected, transmitted and/or scattered by the material may serve as input for the analyzer electronics. The fluid may be pre-concentrated prior to being brought in contact with the material. The area on the material may be a spot having an outside dimension of less than one millimeter.

Gas analyzer cassette system

Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material area of coverage and a second material is deposited over the first material area of coverage to define a second material area of coverage that includes the first material area of coverage and that additionally includes area that surrounds the first material area of coverage, such that the first material is enclosed by the second material over the entire area and past the edges of the first material.

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Buffalo, MN, United States of America

Leonard Hilton