Unisys Corporation

Leonard Harry Alton

Jerry Ihor Tustaniwskyj

Ronald Jack Kuntz

Terrence Evan Lewis

Mark DeWayne Bestul

Ronald Allen Norell

Jerry Ihor Tustaniwskyi

James Dunbar Walker

A connector for sending power to an IC-chip thru four pressed joints in series includes a solid conductive block having a top surface with a first pair of spaced-apart channels and a bottom surface with a second pair of spaced apart channels. The connector also includes a first springy contact having a center section which touches the top surface of the block in the space between the first pair of channels, and having two ends which are held by the first pair of channels. The connector further includes a second springy contact having a center section which touches the bottom surface of the block in the space between the second pair of channels, and having two ends which are held by the second pair of channels.

Connector for sending power to an IC-chip thru four pressed joints in series

A connector for making multiple pressed co-axial connections is comprised of an electrically conductive block which has a top surface, a bottom surface, a plurality of signal holes which extend from the top surface to the bottom surface, and a ground terminal. Top and bottom electrically insulative plates are respectively attached to the top and bottom surfaces of the block. Each plate has alignment holes that are aligned with the signal holes; lying in each signal hole is the body of a respective signal contact; and each signal contact has two springy probes which extend from the body thru respective alignment holes in the top and bottom plates. These springy probes are for contacting external signal pads, and they hold the body of each signal contact such that it is surrounded by a uniform air gap in the center of its respective signal hole.

Connector for making multiple pressed co-axial connections having an air dielectric

An electromechanical subassembly is comprised of a carrier having a body with a planar surface and multiple holes that extend from the planar surface into the body. A plurality of springy contacts are held in the holes; and they extend, in an uncompressed state, past the planar surface. The plurality of springy contacts include contacts of a first type which each exert a relatively small opposing force when compressed to the planar surface, and contacts of a second type which each exert a substantially larger opposing force when compressed to the planar surface.

Electromechanical subassembly including a carrier with springy contacts

An electromechanical module with pressed electrical connections includes the following components: 1) a printed circuit board having a first array of I/O pads; 2) a substrate having a second array of I/O pads that are aligned with and face the first array of I/O pads; 3) compressible electrical contacts which lie between the first and second array of I/O pads; 4) a thin springy plate having a central section which presses against the printed circuit board in line with the first array of I/O pads, and having a springy periphery that extends in a quiescent state away; from the printed circuit board; and 5) a compressing means which compresses the electrical contacts by forcing the substrate towards the printed circuit board while bending the springy periphery of the thin-springy plate towards the substrate. When the plate is in a state where the electrical contacts are fully compressed, the thin-springy plate is relatively flat; and thus, the module has a low profile. Maximum deflection and stress in the printed circuit board are kept below an acceptable limit by selecting the particular locations where the central section of the thin springy plate presses against the board.

Electromechanical module having a thin springy plate for establishing

An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

Integrated circuit module having springy contacts of at least two

A pressure-mountable, electro-mechanical assembly includes a housing which holds an integrated circuit chip in an open cavity; and, the housing has conductors that connect the chip to a pattern of metal pads on an exterior surface of the housing. A lid lies on the exterior surface of the housing, covers the cavity, and has terminal holes that match and expose the pattern of metal pads. Respective conductive springs are held in the terminal holes, contact the metal pads, and project from the lid. This lid operates as both a protective cover for the chip and a carrier for the springs.

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Escondido, CA, United States of America

Leonard Harry Alton