Northrop Grumman Systems Corporation

Microsoft Technology Licensing, LLC

Other

Leonard George Chorosinski

Stanley Katsuyoshi Wakamiya

Martin Brokner Christiansen

H Craig Heffner

Keith R Kirkwood

Harlan Craig Heffner

Anastasios P Goutzoulis

Venkatesh V Sundaram

Parrish E Ralston

Mario J Venetos

William V Miles

Shawn P Miles

A method of encapsulating integrated circuits is disclosed. The method includes placing a front side of a semiconductor wafer, having partially cut scribe lines that separate a plurality of semiconductor dies, onto a backside of a dicing tape, grinding a backside of the cut semiconductor wafer to singulate the plurality of semiconductor dies, exposing the backside of the dicing tape to ultraviolet (UV) light to soften the dicing tape between each of the plurality of semiconductor dies and stretching the dicing tape to increase a distance between the plurality of semiconductor dies, laminating a backside and sides of each of the plurality of semiconductor dies with a first layer of encapsulant material, exposing a front side of the dicing tape to UV light to release the dicing tape from the plurality of semiconductor dies, and laminating a front side of the semiconductor dies with a second layer of encapsulant material.

Encapsulation process for semiconductor devices

An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

Immersion cooling temperature control method, system, and apparatus

A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

Circuit card rack system and method

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.

Computing system with superconducting and non-superconducting components located on a common substrate

Interconnect systems for coupling a first system operating in a first type of environment (e.g., a cryogenic environment) to a second system operating in a second type of environment (e.g., a non-cryogenic environment) are provided. An interconnect system includes a first connector coupled to optical fibers that are coupled to the first system operating in the first type of environment. The interconnect system further includes a second connector coupled to optical fibers that are coupled to the second system operating in the second type of environment. The interconnect system may include an optical window configured to couple optical signals between the optical fibers, and the optical window is configured to maintain a vacuum seal between the first type of environment and the second type of environment such that the first type of environment is substantially thermally isolated from the second type of environment.

Fiber-optic feedthroughs for superconducting systems

An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.

Apparatus and method for providing a temperature-differential circuit card environment

A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.

Circuit card assembly and method of providing same

A medication dispensing system including a relatively small, microprocessor-controlled machine that assists in the accurate execution of a physician-prescribed medication regimen is disclosed. The correct dose of each medication that is to be dispensed at a particular time is stored in an individual packet defined in a flexible tape. The machine dispenses each packet of medication in the correct dose at the prescribed time by analysis of the information regarding the medications to be dispensed and other patient information which is printed in text and in barcode on the packets of the flexible tape. The machine can be used as a stand-alone unit, or can be integrated into a centrally-controlled pharmaceutical network.

Growing community of inventors

Ellicott City, MD, United States of America

Leonard George Chorosinski