Amp LLC

Leonard F Bendiksen

Terry P Bowen

William L Schumacher

An electro-optic device assembly and handling technique is disclosed. The assembly comprises an elongate combination heat sink and retention clip, a heat dispersive substrate affixed to one elongate face of the clip and having lead means secured to an outward face thereof, and an electrooptic chip mounted upon the substrate making electrical contact with the leads. A length of waveguide is bonded to an active portion of the chip, and a ferrule member is provided having a profiled passageway for receiving the above assembly therein. Subsequently, the ferrule is inserted into a header housing, and malleable ends of the heat sink clip are inwardly clasped upon the profile of the header housing to secure the heat sink clip, and assembly elements thereupon, to the connector housing.

Electro-optic device assembly having integral heat sink/retention means

A low profile, sleeve form bushing is cast from metal and provides a coupling for an optical cable and a photoelectric element which is plugged into one end of the bushing and held in place with a press-on retention plate. A slotted flange on the bushing receives the rim of an inverted metal receptacle, placed over the photoelectric element to serve as a shielding cover at one end of the bushing. The other end of the bushing is of sleeve form, externally threaded to receive a threaded cap of a resilient ferrule connector.

Photoelectric element/optical cable connector

The disclosure relates to a connector subassembly which provides an optic adaptor junction for a waveguide or an optic transmission line, the connector having a short length of optic waveguide concentrically received within a diametrically resilient ferrule, with one end of the waveguide adapted for concentric alignment with the transmission line, and with the other end located within a cavity of the ferrule which mounts a photoactive section of an optical electronic device in precise coincident alignment with the waveguide.

Growing community of inventors

Harrisburg, PA, United States of America

Leonard F Bendiksen