At&t Bell Laboratories

At+t Corp.

Other

Bell Telephone Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

Leonard C Feldman

George J Zydzik

Barry Irwin Miller

Erdmann F Schubert

John C Bean

Anthony Thomas Fiory

Yiu-Huen Wong

Hans-Joachim Ludwig Gossmann

Ran-Hong Yan

Bertram Schwartz

John Milo Poate

Igal M Brener

Avishay Katz

Dennis G Deppe

William C Dautremont-Smith

Joze Bevk

Neil E Hunt

Rose F Kopf

Dale C Jacobson

Gregg S Higashi

Cecilia Y Mak

Henry S Luftman

Albert T Macrander

Marlin W Focht

Rafael Kalish

Joseph S Kraus

Arjen M Vredenberg

Netzer Moriya

Li Wei Tu

Netzer Amorai-Moriya

Norman H Tolk

Morton M Traum

John C Tully

A container is configured to store and dispense a material. More specifically, the container includes a top portion that is configured to be partially torn from a body portion of the container to dispense the material. The container includes a reinforced side portion that resists tearing. The tear-resistive portion may incorporate a strand (or thread) that is significantly more difficult to tear, as compared to the container, itself. In an implementation, the container may includes two hollow portions&#x2014;a first portion for storing material and a second portion for securing the resistive thread. The two hollow portions may be separated by a crimped portion of the container. In other implementations, front and rear portions of the container may be glued together to create the two hollow portions. Alternately, the lateral edges of the front and rear surfaces of the container may be fused to create the tear-resistive portion.

Tear-resistive container for dispensing materials

A new method to fabricate strain patterns on a strained semiconductor structure, is disclosed. The method is based on the new concept of reverse side etching of a laterally homogeneous, strained structure so that strain changes can be induced in the front-side, pre-strained area as a result of the reverse side etching process. Semiconductor structures such as quantum-wires, quantum dots, and quantum well devices may be formed by the disclosed methods where the reverse side etching provides strain control of the material properties of the semiconductor structure without processing the front side which is generally the active and the most sensitive region of the semiconductor structure. Such semiconductor structures can be formed by a process including the steps of forming a strained layer on the front-side of the structure, and etching the reverse side of the substrate to form a pattern of strain into the front-side, thus forming selectively strained regions.

Reverse side etching for producing layers with strain variation

A process for making a MOS device on a silicon substrate includes the step of forming a buried layer of germanium-silicon alloy in the substrate, or, alternatively, a buried layer of silicon enclosed between thin, germanium-rich layers. This buried layer is doped with boron, and tends to confine the boron during annealing and oxidation steps. The process includes a step of exposing the substrate to an oxidizing atmosphere such that an oxide layer 10 .ANG.-500 .ANG. thick is grown on the substrate.

Method for making a semiconductor device including diffusion control

A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser or ion-implantation induced conductivity. The path advantageously can be the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating or electroless plating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate.

Metallized paths on diamond surfaces

It has been found that selective metallization in integrated circuits is expeditiously achieved through a copper plating procedure. In this process, palladium silicide is used as a catalytic surface and an electroless plating bath is employed to introduce copper plating only in regions where the silicide is present. Use of this procedure yields superior filling of vias and windows with excellent conductivity.

Fabrication of electronic devices by electroless plating of copper onto

This invention embodies an optical device with a Fabry-Perot cavity formed by two reflective mirrors and an active layer which is doped with a rare earth element selected from lanthanide series elements with number 57 through 71. The thickness of the active layer being a whole number multiple of .lambda./2 wherein .lambda. is the operating, or emissive, wavelength of the device, said whole number being one of the numbers ranging from 1 to 5, the fundamental mode of the cavity being in resonance with the emission wavelength of said selected rare earth element. Cavity-quality factors exceeding Q=300 and finesses of 73 are achieved with structures consisting of two Si/SiO.sub.2 distributed Bragg reflector (DBR) mirrors and an Er-implanted (.lambda./2) SiO.sub.2 active region. The bottom DBR mirror consists of four pairs and the upper DBR mirror consists of two-and-a half pairs of quarterwave (.lambda./4) layers of Si and SiO.sub.2. Photoluminescence at room temperature reveals a drastic enhancement of the luminescence intensity of the cavity emitted along the optical axis of the cavity versus the luminescence without the top mirror. The luminescence intensity of the cavity is typically 1-2 orders of magnitudes higher as compared to structures without a cavity. Furthermore, since the emission wavelength and the intensity decrease for off-normal emission angles, the change in emission wavelength can be quantitatively described by assuming that the on-axis component of the optical wave is resonant with the cavity.

Erbium doped optical devices

This invention is a semiconductor vertical cavity surface emitting laser comprising a lasing cavity with an active layer, a bottom (rear) mirror and a top (front) mirror, and a front and rear electrodes for applying excitation current in direction substantially parallel to the direction of optical propagation. In accordance with this invention the front mirror comprises a thin, semitransparent metal layer which also acts as the front electrode. The metal layer is upon a highly doped layer forming a non-alloyed ohmic contact. The metal is selected from Ag and Al and is deposited in thickness ranging from 5 to 55 nm. The VCSEL is a semiconductor device wherein the semiconductor material is a III-V or II-VI compound semiconductor. For a VCSEL with GaAs active layer, the light output from the front metal mirror/electrode side yields a high external differential quantum efficiency as high as 54 percent. This is the highest quantum efficiency obtained in VCSEL structures. Quantum efficiencies on the oder of 10 to 30 percent are typical for prior art VCSEL structures. The VCSEL is suitable for fabrication utilizing planar technology.

Vertical cavity surface emitting lasers with electrically conducting

A molecular beam epitaxy method of growing Ge.sub.x Si.sub.1-x films on silicon substrate is described. Semiconductor heterostructures using Ge.sub.x Si.sub.1-x layers grown on either Ge or Si substrates are described.

Semiconductor heterostructures having Ge.sub.x Si.sub.1-x layers on Si

Helium-3 and helium-4 bombardment of InP over a fluence range of 10.sup.11 to 10.sup.16 ions/cm.sup.2 reproducibly forms highly resistive regions in both p-type and n-type single crystal material. Average peak resistivities are about 10.sup.9 ohm-cm for p-type InP and are about 10.sup.3 ohm-cm for n-type InP. High resistivity has also been produced in GaP, GaSb, GaAs, and InGaAs by helium bombardment. Stripe geometry lasers and planar photodiodes which incorporate helium-bombarded zones are described.

High resistivity group III-V compounds by helium bombardment

A molecular beam epitaxy method of growing Ge.sub.x Si.sub.1-x films on silicon substrate is described.

Method for epitaxially growing Ge.sub.x Si.sub.1-x layers on Si

Emission of characteristic electromagnetic radiation in the infrared, visible, or UV from excited particles, typically ions, molecules, or neutral atoms, desorbed from solid surfaces by an incident beam of low-momentum probe radiation has been observed. Disclosed is a method for characterizing solid surfaces based on the observed effect, with low-momentum probe radiation consisting of electrons or photons. Further disclosed is a method for controlling manufacturing processes that is also based on the observed effect. The latter method can, for instance, be advantageously applied in integrated circuit-, integrated optics-, and magnetic bubble device manufacture. Specific examples of applications of the method are registering of masks, control of a direct-writing processing beam, end-point detection in etching, and control of a processing beam for laser- or electron-beam annealing or ion implantation.

Method and apparatus for surface characterization and process control

Growing community of inventors

Berkeley Heights, NJ, United States of America

Leonard C Feldman