Tektronix, Inc.

Leonard A Roland

Ira G Pollock

H Erwin Grellmann

James E Spinar

Heinz Erwin Grellmann

Kathleen F Ullom

Larry R Lockwood

Carl W Laakso

John J Reagan

H Erwin Grellman

The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Method of manufacturing probe with printed tip

The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Probe with printed tip

An integrated pad switch has conductive contacts that may be embedded in a flexible substrate to form a wiper contact. The flexible substrate is backed by a foamed elastic block and mounted on a driver. The wiper contact moves across the surface of a hybrid circuit substrate having an electrical circuit to provide the desired switching function.

Integrated pad switch

A high frequency coaxial switch has a coaxial connector mounted on a housing to provide electrical access to a cavity within the housing, the cavity being small to suppress moding. The coaxial connector is electrically connected to a microstrip conductor on a hybrid circuit board within the cavity, and switching is accomplished by compensated contact striplines which electrically make or break contact with the microstrip conductor.

High frequency coaxial switch

A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.

Impedance match connection using multiple layers of bond wires

A broad band, thin film attenuator for microwave circuits is constructed by placing a ground plane conductor on one side of a ceramic, insulating substrate, and conductive, resistive, and reactive elements on the other side of the substrate. Capacitive stubs are provided to compensate for inductance in grounding conductors between resistance elements and the ground plane conductor. Constrictions are provided in input and output conductors to provide increased series inductance to compensate for distributed capacitance of the resistance elements. One resistance element is constructed so that the interface between the input conductor and that resistance element forms an obtuse interior angle with an adjoining transitional edge extending from the input conductor to the grounding conductor, and the transitional edge forms an obtuse interior angle with the adjoining edge of the grounding conductor, so as to minimize current density concentrations and distributed capacitance. A second resistance element is employed to achieve additional attenuation.

Broad band, thin film attenuator and method for construction thereof

An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.

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Portland, OR, United States of America

Leonard A Roland