Emc Corporation

Leonard A Merrill

Stuart Douglas Downes

F William French

A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a heat dispersion device configured discretely from the heat absorbing device and the board for dispersing heat input thereto and a heat transporting device coupled between the heat absorption device and the heat dispersion device for transporting heat absorbed by the heat absorption device to the heat dispersion device.

Method and apparatus for dispersing heat from high-power electronic devices

An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact. The contact may be symmetrical so that the solder preform can be supported on either conductive pin.

Electrical contact for a printed circuit board

An electrical pin contact for mounting on a printed circuit board to provide an electrical interconnection to the printed circuit board. The contact includes an elongated, conductive pin, and a base attached to one end of the pin. The base has a triangular cross-section with vertices that engage a plate-through hole to support the contact in the plated-through hole during a soldering process. The contact may include a flange or stops to support the contact on a printed circuit board. The contact may also include a tail extending from the base opposite the pin.

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Millis, MA, United States of America

Leonard A Merrill