Texas Instruments Corporation

Leon Stiborek

Gray E Fowler

Donald L Purinton

Martin L Catt

Daniel Lee Revier

Karl L Worthen

David B Blair

Alexey Berd

An antenna includes a metal member having a surface that includes a slot. The metal member includes a plurality of legs orthogonal to the surface of the metal member. The plurality of legs are configured to be attached to a circuit board. A first dielectric material is in the slot.

Molded packaged antenna

The present invention provides, in one embodiment, a semiconductor wafer () dicing process. The dicing process comprises removing circuit features () from a street () located between dies () on a semiconductor substrate () using a first blade (), such that the semiconductor substrate is exposed, and cutting through the exposed semiconductor substrate using a second blade (). The first blade has a surface () coated with an abrasive material () comprising grit particles (), having a median diameter () of at least about 25 microns. The grit particles are adhered to the first blade with a bonding agent () having a hardness of about 80 or less (Rockwell B Hardness scale). The grit particles have a concentration in the bonding agent ranging from about 25 to about 50 vol %. Another embodiment of the invention is a method of manufacturing a semiconductor device ().

Method for dicing and singulating substrates

A polymeric three-layer membrane having metal-filled microscopic pores extending through the complete thickness of the membrane, including a central restraining core layer, and an adhesive layer on each surface of the core layer. The membrane is used to form interconnects between electronic parts.

Restrained center core anisotropically conductive adhesive

An absorber for a microwave module and method of fabrication thereof wherein an ink is provided from a mixture of powdered iron and a resin. The ink is then screen printed or mask printed onto the interior surface of the lid of the microwave module in a predetermined pattern to lower the Q of the cavities within the module. The lowered Q suppresses the electromagnetic resonance and thereby minimizes the EMI problems. Furthermore, the absorber material reduces EMI between sections of the module at frequencies where no cavity resonances occur.

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Dallas, TX, United States of America

Leon Stiborek