International Business Machines Corporation

Leo Raymond Buda

Voya Rista Markovich

George Frederick Walker

Anilkumar Chinuprasad Bhatt

Anthony P Ingraham

Jaynal Abedin Molla

Robert Douglas Edwards

Richard Stuart Zarr

Paul Joseph Hart

Richard Gerald Murphy

Bette Jaye Whalen

George John Saxenmeyer, Jr

A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

Method and apparatus for in-situ testing of integrated circuit chips

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Vestal, NY, United States of America

Leo Raymond Buda