Massachusetts Institute of Technology

Leo J Missaggia

James N Walpole

Stephen R Chinn

Christine A Wang

Emily S Kintzer

A semiconductor laser gain structure having a tapered gain region comprising cavity spoilers for receiving light which is reflected off of the output facet back into the semiconductor and removing it from the gain region so as to reduce or eliminate self-oscillation. The boundaries of the gain region are also designed to have a very low refractive index gradient so as to minimize reflection of light off of the boundaries back into the gain region. The gain structure may be embodied in a semiconductor laser oscillator or semiconductor laser amplifier depending on whether the input facet is or is not, respectively, anti-reflection coated. The output facet is anti-reflection coated in either embodiment.

Tapered semiconductor laser gain structure with cavity spoiling grooves

A semiconductor laser gain structure having a tapered gain region comprising cavity spoilers for receiving light which is reflected off of the output facet back into the semiconductor and removing it from the gain region so as to reduce or eliminate self oscillation. The boundaries of the gain region are also designed to have a very low refractive index gradient so as to minimize reflection of light off of the boundaries back into the gain region. The gain structure may be embodied in a semiconductor laser oscillator or semiconductor laser amplifier depending on whether the input facet is or is not, respectively, anti reflection coated. The output facet is anti-reflection coated in either embodiment.

A microchannel heat sink with coolant flowing in alternate directions in adjacent channels. The microchannel heat sink is used for cooling the electronic device making thermal contact with the surface of the heat sink. The alternate directions of the coolant flow eliminate temperature variation along the channel length caused by the heating of the coolant. This new 'alternating channel flow' heat sink design achieves a nearly uniform temperature and thermal resistance on the surface of the heat sink and effectively cools the electronic device in contact.

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Milford, MA, United States of America

Leo J Missaggia