Henkel Ag & Company, Kgaa

Emc IP Holding Company LLC

Henkel IP Holding Gmbh

Leo Hao Li

Chao Wang

Shabbir Attarwala

Wei Zhang

Chunfu Chen

Robert Guowu Xia

Charles Chao Wang

Jiayin Wang

David Weiwei Qian

Wilber Li Tian

Martin Xiaodong Yang

The present invention is directed to a two component (2K) composition comprising:

Two component (2K) composition based on modified epoxy resin

Embodiments of the present disclosure provide a method, a computer program product and a computing device for software test by wherein a computing device, wherein at least one virtual hardware component, each virtual hardware component simulating a behavior of a hardware component associated with a to-be-tested software, and testing the to-be-tested software based on the behavior simulated by the at least one virtual hardware component.

Software testing

The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Adhesive composition for temporarily bonding use in wafer manufacturing

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Shanghai, China

Leo Hao Li