Infineon Technologies Ag

Infineon Technologies Austria Ag

Semiconductor Components Industries, LLC

Leo Aichriedler

Peter Slama

Gerald Wriessnegger

Dietmar Spitzer

Udo Ausserlechner

Friedrich Rasbornig

Harald Witschnig

Dirk Hammerschmidt

Thomas Hafner

Juergen Hoegerl

Tobias Werth

Christof Michenthaler

Helmut Koeck

Christian Schweikert

Andrea Monterastelli

Ramdas Ugale

Gaetano Formato

Kennith Kin Leong

Tomas Manuel Reiter

Hubert Rothleitner

Uwe Kirchner

Christoph Koch

Michael Ortner

Michael Breunig

Stefano De Filippis

Gerhard Pircher

Diego Lunardini

Sam Vermeir

Andrii Kazarinov

Andreas Schenk

Kyoung Seop Kim

Johannes Hackl

Volker Thorsten Schmidt

Udo John

A semiconductor module includes a semiconductor die, a mold compound encasing the semiconductor die, a plurality of terminals electrically connected to the semiconductor die and protruding out of the mold compound, wherein a first one of the terminals has a constricted region covered by the mold compound, wherein the mold compound has a recess or an opening near the constricted region of the first terminal, and a coreless magnetic field sensor disposed in the recess or the opening of the mold compound and isolated from the first terminal by the mold compound. The coreless magnetic sensor is configured to generate a signal in response to a magnetic field produced by current flowing in the constricted region of the first terminal. The magnitude of the signal is proportional to the amount of current flowing in the constricted region of the first terminal. A method of manufacturing the module also is described.

Semiconductor module with external power sensor

An apparatus comprises a switch and a capacitor connected to the switch and to a gate driver that drives a gate of a solid state device. The gate driver is operated to perform a test sequence for the solid state device. The test sequence includes turning on a switch and charging a capacitor to a supply voltage during an initial phase. During a first phase, the switch and the solid state device are turned off, the gate driver is disconnected from the supply voltage, and the gate driver drives the gate of the solid state device based at least upon a charge of the capacitor. During a second phase, the gate driver drives the gate of the solid state device to turn on the solid state device. A gate charge at the gate of the solid state device is measured as an operational state of the solid state device.

Gate charge and leakage measurement test sequence for solid state devices

A method and slave devices are disclosed in which an address assignment to slave devices takes place with the aid of a collision detection. The slave device receives an initialization signal, transmits an identifier over a bus in response to the initialization signal, checks whether a collision occurs on the bus when transmitting the identifier, and if a collision occurs, places the slave device into an inactive state, and if no collision occurs, receives an address for the slave device after the transmission of the identifier.

Slave device, bus system, and methods

An apparatus comprises a solid state device and a switch in series with the solid state device. The apparatus comprises a leak detection component connected to the solid state device. The apparatus comprises a gate driver configured to drive a gate of the solid state device. The gate driver comprises test circuitry configured to apply a test voltage to the gate of the solid state device. The test voltage is less than a threshold voltage of the solid state device. The leak detection component is configured to detect a leakage of the solid state device.

Current leak detection for solid state devices

A unidirectional power switch includes: a normally-on switch device having a normally-on gate, a source, and a drain; a normally-off switch device having a normally-off gate, a source, and a drain, the drain of the normally-off switch device being electrically connected to the source of the normally-on switch device in a cascode configuration; a first source terminal electrically connected to the source of the normally-off switch device; a second source terminal electrically connected to the source of the normally-on switch device; and a drain terminal electrically connected to the drain of the normally-on switch device. The unidirectional power switch is configurable as either a normally-off unidirectional switch or a normally-on unidirectional switch, depending on a configuration of external gate driver connections to the source terminals. Additional power switch embodiments and related methods of configuring the power switches are described, including a configurable bidirectional power switch.

Bidirectional power switch

A sensor may determine, based on two or more synchronization signals provided by a control device, an expected time for receiving an upcoming synchronization signal. The sensor may perform a measurement of a sensor signal at a point in time such that sensor data, corresponding to the measurement of the sensor signal at the point in time, is available at a selectable time interval prior to reception of the upcoming synchronization signal.

Synchronization mechanism for high speed sensor interface

A power connector is provided that is configured to conduct a current and includes a conductive frame including a base structure, an extension structure, and a cap structure that define a current path for the current. The base structure is configured to be coupled to a current supply for receiving the current therefrom. The cap structure is configured to be coupled to an electrical interface of a device to be supplied with the current and outputs the current from the connector to the electrical interface of the device. The extension structure is coupled to and vertically extends between the base structure and the cap structure. The extension structure includes a current constriction region that is configured to cause a defined magnetic field of the current flowing through the current constriction region at a predefined position.

Magnetic current sensor integration into high current connector device

The present disclosure relates to a sensor system, comprising a microcontroller, at least one sensor chip designed to measure a physical quantity, wherein the microcontroller and the sensor chip are coupled to one another via at least one analog signal interface for conveying analog measurement data between the sensor chip and the microcontroller and via a bidirectional digital signal interface for conveying digital secondary information between the sensor chip and the microcontroller.

Communication between a microcontroller and at least one sensor chip

A busbar for current transport comprises conductive material, which extends along a current direction. A recess for a magnetic field sensor extends into the conductive material, a middle of the recess being shifted by a predetermined distance from a middle of the conductive material in the direction of an edge of the conductive material, so that, within a frequency range, a frequency dependency of a magnetic field, which is induced by an alternating current flowing along the current direction, is reduced in comparison with a busbar having a central recess.

Busbar and power module with busbar

A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0&#xb0; and 360&#xb0; and generate a sensing signal. The electronic circuitry is configured to receive and process the sensing signal from the magnetic field sensitive element to generate an angle signal indicating the orientation angle of the magnetic field and an angular speed of the shaft.

Angle based speed sensor device

Systems, methods, and apparatuses are discussed that enable robust, high-speed communication of sensor data. One example system includes a sensor bus, an electronic control unit (ECU), and one or more sensors. The ECU is coupleable to the sensor bus and configured to generate a synchronization signal, and is configured to output the synchronization signal to the sensor bus. The one or more sensors are also coupleable to the sensor bus, and at least one sensor of the one or more sensors is configured to sample sensor data in response to the synchronization signal and to output the sampled sensor data to the sensor bus.

Robust high speed sensor interface for remote sensors

A device for a single wire digital bus, includes an interface for the bus configured to receive a request to arbitrate for an address and to transmit device specific data on the bus upon receipt of the request to arbitrate for an address The device further includes a control circuit configured to determine, if a further device transmits device specific data on the bus, and to use the address arbitrated for, if no further device transmits device specific data on the bus.

Device for a single wire digital bus, master device, sensor, and method to assign addresses to multiple devices on a single wire digital bus

A motor drive circuit provides a drive signal to an electronically commutated motor. A control circuit the motor drive circuit based on calibration data. The calibration data indicate a relationship between an actual angular position of a rotor of the motor in response to the drive signal and an expected angular position of a rotor of an ideal motor in response to the drive signal.

Generation of motor drive signals with misalignment compensation

A sensor may determine a sampling pattern based on a group of synchronization signals received by the sensor. The sampling pattern may identify an expected time for receiving an upcoming synchronization signal. The sensor may trigger, based on the sampling pattern, a performance of a sensor operation associated with the upcoming synchronization signal. The performance of the sensor operation may be triggered before the upcoming synchronization signal is received.

A sensor arrangement, including: a rotatable driving shaft extending along a rotation axis and comprising a bore extending from a first end face of the shaft along the rotation axis; a substantially ring-shaped magnet arranged within the bore and coupled to the driving shaft, the magnet configured to generate a magnetic field within the bore; and a sensor configured to sense a rotation of the magnetic field in response to rotation of the driving shaft.

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Puch, Austria

Leo Aichriedler