Apple Inc.

Other

Leland W Lew

Fernando Alberto Mujica

Joyce Y Kwong

Cyril De La Cropte De Chanterac

Paul A Baker

Joseph Hakim

Hue Duc Tran

Jun Zhai

Kevin J White

Mengzhi Pang

Se Young Yang

Abhilash Rajagopal

Mark P Colosky

In an embodiment, an automation system for a vehicle may employ a variety of diversities to enhance reliability, accuracy, and stability in automating operation of the vehicle. For example, in an embodiment, an automation system for a vehicle may include multiple sensor pods with overlapping fields of view. Each sensor pod may include multiple different sensors in an embodiment, providing diverse views of the environment surrounding the vehicle. A set of sensor pods with overlapping fields of view may also transmit their object data at different points in time, providing diversity in time. Redundancy in other areas, such as the network switches which connect the sensor pods to an automation controller, may also aid in provided fail operational functionality. In an embodiment, the sensor pods may include local processing to process the data captured by the sensors into object identification.

Architecture for automation and fail operational automation

This application relates to systems, methods, and apparatus for using a computing device to perform payment transactions while the computing device is operating in a low power wallet mode during a low battery state of the computing device. During a low power wallet mode, various subsystems are prevented from receiving current from a battery of the computing device, while a near field communication (NFC) system of the computing device is provided with an operating current for detecting target systems. A target system and the NFC system can communicate during the low power wallet mode of the computing device, thereby allowing a user of the computing device to conduct payment transactions when the computing device is in a low power wallet mode. Such payment transactions can be useful if the user is ever stranded without enough power to fully operate the computing device and needs to pay for transportation.

Low power mode for payment transactions

Data generated by one or more data producers may be transmitted via multiple communication paths according to a path transmission scheme that divides transmission of different portions of the data amongst different communication paths. Upon a failure of a communication path, transmission of data may continue for those portions of data that are not assigned to the failed communication path. In some embodiments, modifications to the path transmission scheme may be made to change the division of data amongst remaining communication paths in the event of failure.

Redundant communication path transmission

Aspects of the present disclosure involve a circuit for delivering electrical power from a direct current voltage source to an electronic system. The circuit may include a power injection circuit that injects a first portion of the power from a supply voltage of the source to a first data line and a second portion of the power from the supply voltage to a second data line. The power injection circuit may include first and second conductive paths from the supply voltage to the first and second data lines having first and second inductances, respectively, as well as a third conductive path between the first and second data lines having a third inductance greater than the first and second inductances. A conductive support structure may carry return current from the electronic system to the source.

Provision of power over a data interface using a separate return path

Circuits, methods, and apparatus that may provide a wired communication path that is simple to implement and does not greatly increase costs and complexity. One example may provide an electronic device having wired data path, where the wired data path is implemented using a power connection. Data from a wireless signal path may be routed and combined with a power supply voltage. This combined signal may then be provided to, or received from, a second electronic device over the power connection. The combined signal may be provided at a power connection that may include a power and ground path, paths for multiple power supplies, or paths for multiple power supplies and ground.

Alternative routing of wireless data onto power supply

In some embodiments, a semiconductor device package assembly may include a first substrate. The first substrate may include a first set of electrical conductors which electrically connect the assembly. In some embodiments, the assembly may include at least one electrical conductor coupled to the first substrate such that at least one of the electrical conductors exposes through a perimeter surface of the semiconductor device package assembly. In some embodiments, the assembly may include a first die electrically connected to a second surface of the first substrate using a second set of electrical conductors. The assembly may include an electronic memory module coupled to the first die. In some embodiments, the assembly may include a shield applied to an upper surface of the assembly and electrically coupled to at least one of the exposed electrical conductors. The shield may inhibit, during use, electromagnetic interference.

Growing community of inventors

Los Altos, CA, United States of America

Leland W Lew