Georgia Tech Research Corporation

Lejun Wang

Ching-Ping Wong

Haiying Li

A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

No-flow reworkable epoxy underfills for flip-chip applications

A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

Thermally degradable epoxy underfills for flip-chip applications

A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.

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Lejun Wang