Globalfoundries Dresden Module One Limited Liability Company & Co. Kg.

Leitao Liu

Steven R Soss

Alban Zaka

Tom Herrmann

Disclosed are a semiconductor structure, which includes a charge-trapping sidewall spacer-type non-volatile memory (CTSS-NVM) device, and a method of forming the structure. The CTSS-NVM device includes asymmetric first and second sidewall spacers on opposing sidewalls of a gate structure above a channel region in a semiconductor substrate. The second sidewall spacer is wider than the first and includes multiple dielectric spacer layers, one of which is made of a charge-trapping material, is separated from the substrate (e.g., by a thin oxide layer), and has a bottom end closest to the substrate with a maximum width that is sufficient to achieve charge-trapping for proper CTSS-NVM device operation. The CTSS-NVM device further includes an epitaxial semiconductor layer for a source/drain region on the semiconductor substrate adjacent to the first sidewall spacer and a metal silicide layer for a Schottky barrier on the semiconductor substrate adjacent to the second sidewall spacer.

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Clifton Park, NY, United States of America

Leitao Liu