Cooler Master Co., Ltd.

Leilei Liu

Chien-Hung Sun

Xiao-Min Zhang

Xuemei Wang

A vapor chamber having a working fluid therein, includes a first and second casing, together forming an evaporator section having a plurality of first support structures therein, a condenser section having a plurality of second support structures therein, and a vapor flow chamber extending from the evaporator section to the condenser section is provided. The evaporator section further includes a plurality of extended heat transfer structures therein, contacting a first inner surface of the evaporator section of the first casing and being perpendicular thereto. The vapor flow chamber includes as least one evaporator vapor flow area. The first inner surface, second inner surface of the first and second casings, plurality of extended heat transfer structures, and at least one of a plurality of first support structures include evenly distributed and substantially the same thickness sintered powdered wick structures thereon. The plurality of first and second support structures supports the first and second casings of the vapor chamber.

Flat heat pipe structure

A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.

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Taipei, Taiwan

Leilei Liu