Cooler Master Development Corporation

Vast Glory Electronic & Hardware & Plastic (hui Zhou) Ltd

Leilei Liu

Xuemei Wang

A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.

Gravity loop thermosyphon and heat dissipation device comprising the same

The instant disclosure relates to a flat heat pipe structure, which includes a flat tubing and a support member. The flat tubing has two opposed main walls and two opposed connecting walls connected thereto. The main and connecting walls cooperatively define an internal space. The inner surfaces of the flat tubing are covered with a capillary structure. The support member is disposed in the internal space of the flat tubing and has at least one support arm. The support arm extends in the longitudinal direction of the flat tubing. The support arm has two opposed surfaces abutting to the capillary structure of the main walls.

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Huizhou, China

Leilei Liu