Intel Corporation

Leigh E Wojewoda

William J Lambert

Kaladhar Radhakrishnan

Yongki Min

Reynaldo Alberto Olmedo

Clive R Hendricks

Venkat Anil K Magadala

Mathew J Manusharow

Thomas Dory

Michael J Hill

David Walter Young

Siddharth Kulasekaran

HengGee Lee

Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.

Package structure having substrate thermal vent structures for inductor cooling

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

Magnetic small footprint inductor array module for on-package voltage regulator

An apparatus, comprising: a substrate having a surface; a die attached to the substrate surface; an underfill material positioned between the substrate surface and the die; and one or more barriers on the substrate surface adjoining the die, wherein the barriers controls flow of the underfill material.

Controlling underfill flow locations on high density packages using physical trenches and dams

Growing community of inventors

Tempe, AZ, United States of America

Leigh E Wojewoda