Hong Kong Beida Jade Bird Display Limited

Jade Bird Display (shanghai) Limited

Apple Inc.

Lei Zhang

Qiming Li

Fang Ou

Wing Cheung Chong

Lina He

Yuewei Zhang

Paul Stephen Drzaic

Dmitry S Sizov

Huiwen Xu

Nathaniel T Lawrence

Ranojoy Bose

Jen-Shyan Chen

Yijing Chen

Wei Hsin Yao

Xiaobin Xin

Display structures and methods of operation with micro light emitting diode (LED) sidewall gating are described. In an embodiment, a display structure includes a vertically oriented micro LED mounted on a display substrate, in which the micro LED includes a p-n diode with top and bottom electrode sides, and a sidewall gate electrode spanning a sidewall of the p-n diode where the active layer is included. In various embodiments, a bias may be applied to the sidewall gate electrode while driving the micro LED to deplete a minority carrier concentration from the sidewall of the p-n diode.

Active / passive control of micro LED performance through sidewall gating

Methods and structures are described to facilitate the transfer of device layer coupons with controlled vertical position. In an embodiment, a plurality of device layer coupons is bonded to a receiving substrate with an adhesive layer, where distance between front surfaces of the plurality of device layer coupons and a bulk layer of the receiving substrate is controlled by a plurality of rigid mechanical spacers.

Methods for die-to-wafer device layer transfer with precise control of device layer vertical position

A light-emitting diode (LED) display panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits, a micro lens array including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies, and an optical spacer formed between the LED array and the micro lens array.

Light-emitting diode display panel with micro lens array

Optical components such as components that emit light and components that detect light may be provided. Optical components that emit light may include displays having arrays of display pixels with respective light-emitting devices such as crystalline semiconductor light-emitting diodes. Optical components that detect light may include image sensors or other components with arrays of photodetectors. The light-emitting devices and photodetectors in the optical components may be overlapped by metalenses such as multielement metalenses. A multielement metalens may have a first metalens element formed from a first layer of nanostructures arranged and an overlapping second metalens element formed from a second layer of nanostructures. Light sources may be provided on a semiconductor and metalens nanostructures may be formed on an opposing surface of the semiconductor.

Electronic device with stacked metasurface lenses

Inorganic and organic LEDs are integrated in a single chip. In an integrated multi-color micro-LED display panel, arrays of different color micro LEDs are integrated with corresponding driver circuitry. Some colors of micro LEDs are inorganic micro LEDs, and other colors are organic micro LEDs. Inorganic versus organic can be selected on the basis of efficiency, for example using inorganic micro LEDs for blue pixels and organic micro LEDs for red and green pixels. In one approach, an array of pixel drivers is first fabricated on a supporting substrate. Multiple strata of micro LEDs are then stacked on top of the base substrate. The strata containing inorganic micro LEDs are fabricated first, with one color per stratum. A single stratum containing all of the organic micro LEDs is then fabricated at the top of the stack.

LED-OLED hybrid self-emissive display

A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.

Projection display system

A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Making semiconductor devices by stacking strata of micro LEDs

A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.

Semiconductor apparatus and method of manufacturing the same

Making semiconductor devices by stacking strata of micro LEDS

Various embodiments include a multi-color micro-LED array light source that enables well-overlapped light beams of different colors. The multi-color micro-LED array light source includes a thermally conductive substrate and multiple arrays of different color micro-LEDs integrated on the thermally conductive substrate. The micro-LEDs within each array are electrically connected so that they can all be driven in unison. The multi-color array light source also includes a controller that is electrically coupled to and that drives the arrays of micro-LEDs. The controller drives the micro-LEDs in a manner that produces an output light distribution with a spatial wavelength and angular distribution that is suitable for use as a light source.

Multi-color micro-LED array light source

Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an integrated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate substrate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive.

Growing community of inventors

Albuquerque, NM, United States of America

Lei Zhang