Ansys, Inc.

Gear Design Solutions

Lei Yin

John Lee

Norman H Chang

Altan Odabasi

Jimin Wen

Akhilesh Kumar

Jay Prakash Pathak

Wen-Tze Chuang

Murat Becer

Xi Chen

Ying Shiun Li

Ming-Chih Shih

En Cih Yang

Mustafa Yazgan

Bolong Zhang

A specification for a semi-conductor chip is received. The specification specifies a set of photomasks associated with a metal layer of the semi-conductor chip. Multiple portions of an area of the metal layer are identified. A respective image is generated for each portion of the area based on the photomasks. A respective drawn density of metal wires for each portion of the area is calculated. A trained machine learning model is invoked to predict a respective silicon density of metal wires for each respective portion of the area based on an image and a drawn density for the respective portion of the area. A silicon density for the area of the metal layer is calculated based on a combination of predicted silicon densities for the multiple portions of the area. The combination is based on an average value of the predicted silicon densities for the multiple portions of the area.

Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning

Described herein are systems and methods for a partitioned extraction-simulation technique that efficiently combines a partitioned extraction technique and a partitioned simulation technique by removing and not performing particular steps of the techniques to provide a more efficient netlist extraction and circuit simulation process. In some embodiments, a plurality of circuit simulators directly receive and process a plurality of sub-region netlists that are based on a spatial partitioning of the IC layout. In further embodiments, an EDA hybrid cloud system is implemented using pipelining and serializing of memory data. In these embodiments, an overall EDA process is divided into a plurality of pipelined stages to accelerate the computational speed of the overall EDA process. In further embodiments, EDA data is transferred, over a network, from a memory of one computer system directly to a memory of another computer system by serializing the EDA data.

System and method for netlist extraction and circuit simulation

System and method for hybrid cloud computing for electronic design automation

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San Jose, CA, United States of America

Lei Yin