Western Digital (fremont), Inc.

Seagate Technology Incorporated

Aurora Operations, Inc.

Nvidia Corporation

Te Connectivity Solutions Gmbh

Facebook, Inc.

Apple Inc.

3m Innovative Properties Company

Hgst Netherlands, B.v.

Te Connectivity Germany Gmbh

Luminous Computing, Inc.

Western Digital Technologies, Inc.

Te Connectivity Corporation

Te Connectivity Services Gmbh

Read Rite Corporation

Lei Wang

Shaoping Li

Yingjian Chen

Kaizhong Gao

Wenzhong Zhu

Sen Lin

Zongrong Liu

Xiaobin Wang

Shing Lee

Pezhman Monadgemi

Ge Yi

Ting Gao

Dujiang Wan

Hwong-Kwo Lin

Andrew Steil Michaels

Guanghong Luo

Wentao Yan

Quang Le

Xiaoyong Liu

Spencer Montgomery Gold

Dejie Tao

Mitchell A Nahmias

Danning Yang

Arkadi B Goulakov

Brant Nease

Daniele Mauri

Ming Jiang

Wei Zhang

George G I Moore

Yuankai Zheng

Ming Mao

Christian Kaiser

Xizeng Shi

Hong Zhang

Kyusik Sin

Yu Yang

Hua-Ching Tong

William J Kozlovsky

Zhong Shi

Hongping Yuan

Hongquan Jiang

Andre Martin Dressel

Hugh Craig Hiner

Martin William Bayes

Benjamin P Chen

Kumar Gaurav Chhokra

Peter J Dutton

Yiliang Wu

Robert William Mayor

Chad William Morgan

Haiwen Xi

Jun Yang

Song Sheng Xue

George W Griesgraber

Stephen A Johnson

Stephen Felix

Suping Song

John Joseph Consoli

Liubo Hong

Feng Q Liu

Gerardo Bertero

Rongfu Xiao

Petrus Antonius Van Der Heijden

Qunwen Leng

Helge Schmidt

David S Hays

Vaneet Pathak

Yong Shen

Taras Grigorievich Pokhil

Michael P Dal Santo

Michael V Morelli

Ge Yang

Jouya Jadidian

Sergei L Sochava

Yonghua Chen

Isaac Thomas Miller

David T Yust

Hua Chen

Qing I He

Chih-Ching Hu

Steven C Rudy

Jiaoming Qiu

Jing Guo

Honglin Zhu

Richard B Warren

Eric H Voelkel

Manas Haribhai Somaiya

Stephen P Jackson

Aditya Narain Srivastava

Pejman Lotfali Kazemi

Ming Zhao

Shihai He

Ned Tabat

Soenke Sachs

William J Bencze

Brian Stephen Smith

Paul Y Lin

Harsha Shirahatti

Sujeet Milind Patole

A thermoset sealant film includes an epoxy and a hardener. The hardener is integrated with the epoxy and remains physically distinct from the epoxy in a formed state of the thermoset sealant film.

Thermoset sealant film

A semiconductor optical device for a LIDAR sensor system for a vehicle includes a first portion and a second portion bonded to the first portion. The first portion includes a first microlens structure configured to receive a first beam. The first portion also includes a first notch structure coupled to the first microlens structure, the first notch structure configured to receive the first beam and direct the first beam into an environment of the vehicle. The second portion includes a second notch structure surface configured to receive a second beam from the environment of the vehicle. The second portion also includes a second microlens structure coupled to the second notch structure, the second microlens structure configured to receive the second beam reflected by the second notch surface and direct the second beam to a receiver.

Manufacturing process for semiconductor optical device for LIDAR sensor system

A method for manufacturing a semiconductor-based light detection and ranging (LIDAR) system for a vehicle, includes: coupling a first optical component with solder disposed on a first portion of the first optical component to a second optical component in a first alignment operation, where the solder disposed on the first portion of the first optical component is not in contact with the second optical component and coupling the first optical component to a third optical component with solder disposed on a first portion of the third optical component in a second alignment operation, where the solder disposed on the first portion of the third optical component is not in contact with a second portion of the first optical component. Heat is then applied to the solder disposed on the first portion of the first optical component and the solder disposed on the first portion of the third optical component.

LIDAR system and manufacturing method having semiconductor-based optical components coupled together with solder

A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

Photonic integrated circuit system and method of fabrication

A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.

Heat dissipation for LIDAR sensors

A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a transmit beam at a first orientation; a reflective surface configured to redirect the transmit beam from the first orientation to a second orientation; and a lens interface configured to receive the transmit beam at the first orientation and focus the transmit beam onto the reflective surface; wherein the LIDAR system emits the transmit beam at the second orientation into an environment of the LIDAR system.

Autonomous vehicle including LIDAR sensor system having improved photonics interface

A method for manufacturing a semiconductor optical device for a LIDAR sensor system for a vehicle includes (a) forming a plurality of microlens structures at respective first locations on a first major surface of respective first and second semiconductor wafers. The method includes (b) forming a plurality of notch structures at respective second locations on a second major surface of the respective first and second semiconductor wafers, wherein the respective second locations on the second major surface are substantially opposite the respective first locations on the first major surface. The method includes (c) bonding the second major surface of the first semiconductor wafer to the second major surface of the second semiconductor wafer to form a semiconductor wafer pair. The method includes (d) dicing the semiconductor wafer pair to segment the semiconductor wafer pair into a plurality of individual semiconductor optical devices.

Manufacturing process for semiconductor optical device for lidar sensor system

A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.

Silicon-assisted packaging of high power integrated SOA array

A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.

Semiconductor laser and optical amplifier photonic package

A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

Hybrid silicone composite for high temperature applications

Described herein are techniques to enable a mobile device to perform multi-source estimation of an altitude for a location. A baseline altitude may be determined at ground level for a location and used to calibrate a barometric pressure sensor on the mobile device. The calibrated barometric pressure sensor can then estimate changes in altitude relative to ground level based on detected pressure differentials, allowing a relative altitude to ground to be determined. Baseline calibration for the barometric sensor calibration can be performed to determine an ambient ground-level barometric pressure.

Location of interest altitude and determining calibration points

A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ. A process of forming such printable non-curable thixotropic hot melt composition is described.

Printable non-curable thixotropic hot melt composition

A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.

A dispensable grease sealant includes a base component in an amount of 50 wt % or more, based on a total weight of the sealant, and a thickener. The base component is selected from a group including a silicone wax, a liquid rubber, and a combination thereof.

Dispensable grease sealants, method for producing same, crimp connection, method for producing same, and use of the dispensable grease sealants

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Fremont, CA, United States of America

Lei Wang