Zhuhai Access Semiconductor Co., Ltd

Honor Device Co., Ltd.

Huawei Technologies Co., Limited

Zte Corporation

Tencent Technology (shenzhen) Company Limited

Sunbeam Products, Inc.

University of Electronic Science and Technology of China

Nexperia B.v.

Southern Medical University Zhujiang Hospital

Zhuhai Lcola Technology Co., Ltd.

Zhuhai Yuexin Semiconductor Limited Liability Company

Lei Feng

Wei Zhang

Renwei Guo

Benxia Huang

Xianming Chen

Yejie Hong

Wenshi Wang

Jindong Feng

Bingsen Xie

Yameng Wei

Lina Jiang

Wenxing Yao

Zhihua Liu

Yuan Wang

Jian Peng

Fugao Zhao

Xiaoliang Zhang

Minxiong Li

Xiaodong Fan

Yang Liu

Tao Yang

Yang Li

Wei He

Haijun Wu

Gabriel S Kohn

Yaolei Zhang

Haifei Li

Yunan Zhang

Leonard I Horey

Mingqian Gao

Xuyang Wang

Yuan Li

Lei Cai

Fei Ma

Leibo Yuan

Yangjie Tang

Jida Zhang

Jiangjiang Zhao

Min Gu

Weishan Sun

Jun Gao

Weiyuan Yang

Yuanming Chen

Yi Gao

Gao Huang

Chao Han

Handong Zhang

William McCoy

Hansen Zheng

Yanlin Dong

Yongzhi Zeng

Xiao Bao Yang

Xiang Li

Yiping Wu

Xuewen Yin

Linquan Ping

Frank Burmeister

Yujun Zhao

Qili Wei

Jinxin Yi

Edward Tena

Shigui Xin

Guolin He

Pan Ji

Qing Peng

Mingxin Pan

Jun Weng

An embedded packaging structure according to an embodiment of the present disclosure includes an optical communication device embedded in a substrate, and a blocking wall surrounding the working face opening. The optical communication device may include a working face for emitting light or receiving light. The working face may be revealed by a working face opening from a first surface of the substrate. The blocking wall may extend beyond the first surface in a direction away from the first surface.

Embedded packaging structure and method for manufacturing the same

A package substrate manufacturing method includes: providing a bearing plate, manufacturing a pattern and depositing metal to form the first circuit layer; manufacturing a pattern on the first circuit layer, depositing and etching metal to form a metal cavity, laminating a dielectric layer on the metal cavity, and performing thinning to expose the metal cavity; removing the bearing plate, etching the metal cavity to expose the cavity, depositing metal on the cavity and the dielectric layer, and performing pattern manufacturing and etching to form a second circuit layer; forming a first and second solder mask layers correspondingly on the first and second circuit layers, and performing pattern manufacturing on the first solder mask layer or the second solder mask layer to form a bonding pad; and cutting the cavity, the first circuit layer, the second circuit layer, the first solder mask layer and the second solder mask layer.

Package substrate manufacturing method

An inductor-integrating embedded support frame according to an embodiment of the present disclosure includes a core dielectric layer, a through-opening penetrating through the core dielectric layer, wherein the through-opening is used for embedding and installing a device, and an inductor, wherein the inductor includes a magnetic core embedded in the core dielectric layer and an inductance coil wound around the magnetic core, wherein at least one conductive copper pillar penetrating through the core dielectric layer is provided at the periphery of the through-opening and the inductor.

Inductor-integrating embedded support frame and substrate, and manufacturing method thereof

Disclosed are a method for manufacturing a support frame structure and a support frame structure. The support frame structure is used for embedded packaging, and includes: a metal plate comprising a support region and an opening region, at least one upper dielectric hole and at least one lower dielectric hole being formed respectively in upper and lower surfaces of the support region, the upper dielectric hole being communicated with the lower dielectric hole; at least one set of metal pillars comprising an upper metal pillar and a lower metal pillar, the upper metal pillar and the lower metal pillar being vertically connected to upper and lower surfaces of the metal plate, respectively; a dielectric layer comprising an upper dielectric layer and a lower dielectric layer, the upper dielectric layer and the lower dielectric layer being correspondingly formed on the upper surface of the metal plate and the upper dielectric hole and on a lower surface of the metal plate and the lower dielectric hole, respectively; and at least one core embedding cavity arranged in the opening region, running through the dielectric layer and the metal plate, and spaced from the upper dielectric hole and the lower dielectric hole by the dielectric layer.

Support frame structure and manufacturing method thereof

A capacitor and inductor embedded structure and a manufacturing method therefor, and a substrate are disclosed. The method includes: providing a metal plate; sequentially depositing and etching a first protective layer, a thin film dielectric layer, a second protective layer, and an upper electrode layer on an upper surface of the metal plate to form a thin film capacitor and a capacitor upper electrode; pressing an upper dielectric layer to the upper surface of the metal plate, covering the thin film capacitor and the capacitor upper electrode, and etching the metal plate to form a capacitor lower electrode; pressing a lower dielectric layer to a lower surface of the metal plate, and performing drilling on the upper dielectric layer and the lower dielectric layer to form inductor through holes and capacitor electrode through holes; electroplating metal to form an inductor and circuit layers.

Capacitor and inductor embedded structure and manufacturing method therefor, and substrate

Embodiments of this application provide a damping assembly, a rotating mechanism, and a foldable terminal. The damping assembly has a simple structure and occupies a relatively small space, which is conductive to a lightening and thinning design of a foldable terminal. The damping assembly includes a damping section and a shaft sleeve sleeved onto the damping part, where the damping section includes a first damping part and a second damping part, and the shaft sleeve includes a first shaft sleeve part and a second shaft sleeve part an interference amount between the first shaft sleeve part and the first damping part is a first interference amount; an interference amount between the second shaft sleeve part and the second damping part is a second interference amount, and the second interference amount is less than the first interference amount.

Damping assembly, rotating mechanism, and foldable terminal

An electronic device may include a mobile phone, a tablet computer, a handheld computer, a walkie-talkie, a POS machine, an event data recorder, a wearable device, a virtual reality device, or in-vehicle original equipment or another terminal product with a loudspeaker. An inner wall of a mounting cavity for mounting a loudspeaker and the loudspeaker are respectively provided with mating surfaces that adapt to each other. In the two mating surfaces, one is provided with a flexible sealing member and a limiting structure, and the other is provided with a rigid sealing member. When the loudspeaker is mounted, the rigid sealing member can move relative to the flexible sealing member along a first direction, until the rigid sealing member is mated with the flexible sealing member. The limiting structure can restrict the flexible sealing member from moving.

Electronic device

A guide line display method includes: obtaining a first guide line generated at an imoment and a second guide line generated at an (i+1)moment; pairing positioning points on the first guide line and the second guide line to obtain k matching point pairs; generating a transition guide line by concatenating k intermediate points of the k matching point pairs, the transition guide line being a guide line that transitions from the first guide line displayed at the (i+1)moment to the second guide line displayed at an (i+2)moment; and displaying the transition guide line between the (i+1)moment and the (i+2)moment.

Guide line display method and apparatus, device, and medium

A cover body structure, a back cover, and an electronic device are provided, related to the field of electronic device technologies. The cover body structure includes a glass cover plate, a first ink layer, a first glue layer, and a plastic edge portion. The first ink layer is disposed at least on an edge of the glass cover plate. The first glue layer is disposed on the first ink layer on the edge of the glass cover plate. The plastic edge portion is disposed on the first glue layer on the edge of the glass cover plate. The first glue layer is a glue layer viscous at least at an injection molding temperature of the plastic edge portion, and the first ink layer is an ink layer that is able to withstand the injection molding temperature of the plastic edge portion.

Cover body structure, back cover, and electronic device

A cyclic cooling embedded packaging substrate and a manufacturing method thereof are disclosed. The packaging substrate includes a dielectric material body, a chip, a first metal face, a second metal face and a first trace. The dielectric material body is provided with a packaging cavity, the chip is packaged in the packaging cavity, the first metal face is embedded in the dielectric material body, covers and is connected to a heat dissipation face of the chip. The second metal face is embedded in the dielectric material body, connected to a surface of the first metal face, and is provided with a first cooling channel pattern for forming a cooling channel. The first trace is arranged on a surface of the dielectric material body or embedded therein, and is connected with a corresponding terminal on an active face of the chip through a first conductive structure.

Cyclic cooling embedded packaging substrate and manufacturing method thereof

In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a dielectric material is laminated to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer, a wiring layer is formed on the dielectric layer, the cavity sacrificial post is removed by etching to form a through cavity, a bonding pad is formed on the wiring layer, a reverse side of a device is mounted on the copper foil in the through cavity, and a terminal of the device is wire-bonded with the bonding pad.

Fabrication method for package structure

A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.

Temporary carrier and method for manufacturing coreless substrate thereby

A support apparatus and a foldable electronic device are provided. The support apparatus includes a hinge assembly, a first housing, a second housing, and a first flexible sealing member. The hinge assembly includes a rotating shaft mechanism and a shaft cover, where the rotating shaft mechanism is fastened to the shaft cover. The first housing and the second housing are respectively located on two opposite sides of the hinge assembly, the first housing and the second housing are configured to rotate relative to the shaft cover through the rotating shaft mechanism, the first housing, the second housing, and the rotating shaft mechanism each have a support surface for supporting a foldable screen, and a first movement gap is present between the first housing and an outer surface of the shaft cover. The first flexible sealing member fits into and seals the first movement gap.

Support apparatus and foldable electronic device

A hybrid embedded packaging structure and a manufacturing method thereof are disclosed. The structure includes: a substrate with a first insulating layer, a conductive copper column, a chip-embedded cavity and a first circuit layer; a first electronic device arranged inside the chip-embedded cavity; a second electronic device arranged on a back surface of the first electronic device; a second insulating layer covering and filling the chip-embedded cavity and an upper layer of the substrate, exposing part of the first circuit layer and a back surface of part of the second electronic device or part of the first electronic device; a second circuit layer electrically connected with the conductive copper column and a terminal of the first electronic device; a conducting wire electrically connecting the first circuit layer with a terminal of the second electronic device; and a protection cover arranged on the top surface of the substrate.

Hybrid embedded packaging structure and manufacturing method thereof

This application provides a rotation mechanism, a supporting apparatus, and a foldable screen terminal, and relates to the field of electronic device technologies, so as to balance a lifting stroke of the lifting member and a thickness of the foldable screen terminal in an unfolded state. The rotation mechanism includes a lifting member, a shaft cover, a first swing arm, a second swing arm, a forcing structure, and a first supporting member. The lifting member includes a lamination surface. The shaft cover is located on a side that is of the lifting member and that is away from the lamination surface. The first swing arm and the second swing arm are respectively located on two opposite sides of the lifting member, and the first swing arm and the second swing arm can swing between an unfolded position and a folded position relative to the shaft cover.

Rotation mechanism, supporting apparatus, and foldable screen terminal

Growing community of inventors

Guangdong, China

Lei Feng